Case Connection:
Contact Plating:
Current:
Current - Average Rectified (Io) (per Diode):
Current - Reverse Leakage @ Vr:
JESD-609 Code:
Max Junction Temperature (Tj):
Max Operating Temperature:
Maximum Operating Temperature:
Min Operating Temperature:
Minimum Operating Temperature:
Moisture Sensitivity Level (MSL):
Number of Elements:
Number of Elements per Chip:
Number of Terminations:
Operating Temperature (Max):
Peak Reflow Temperature (Cel):
Qualification:
Reference Standard:
Repetitive Peak Reverse Voltage:
Reverse Recovery Time (trr):
RMS Current (Irms):
Surface Mount:
Technology:
Terminal Position:
Time@Peak Reflow Temperature-Max (s):
Voltage - Forward (Vf) (Max) @ If:
Reverse Test Voltage:
Reverse Voltage (DC):
RFQ
BOM