B0809J50ATI

Manufacturer :

Anaren Wireless / TTM Technologies

Product Category :

Balun

Impedance :

50Ohm

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

HTS Code :

8542.39.00.01

Termination :

SMD/SMT

Number of Terminations :

6

Temperature Grade :

Other

Mount :

Surface Mount

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mounting Type :

Surface Mount

Published :

2010

Min Operating Temperature :

-55°C

Height Seated (Max) :

0.75mm

Frequency Range :

850MHz~915MHz

Package / Case :

0805 (2012 Metric)

Length :

2.04mm

Insertion Loss (dB) :

0.5 dB

Series :

Xinger®

Case Code (Imperial) :

0805

Impedance - Unbalanced/Balanced :

50 / -Ohm

Packaging :

Tape and Reel (TR)

Number of Functions :

1

Terminal Form :

NO LEAD

Terminal Position :

Dual

Factory Lead Time :

12 Weeks

Width :

1.29mm

Return Loss-Min :

15.3dB

Max Operating Temperature :

85°C

Pin Count :

6

Qualification Status :

Not Qualified

Terminal Pitch :

0.65mm

JESD-30 Code :

R-XDMA-N6

Case Code (Metric) :

2012

Insertion Loss (Max) :

0.6dB

RoHS Status :

RoHS Compliant

Telecom IC Type :

TELECOM CIRCUIT