IXDN409PI
- Mfr.Part #
- IXDN409PI
- Manufacturer
- Littelfuse
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC GATE DRVR LOW-SIDE 8DIP
- Stock
- 44,429
- In Stock :
- 44,429
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- Manufacturer :
- Littelfuse
- Product Category :
- Gate Drivers
- HTS Code :
- 8542.39.00.01
- Published :
- 2004
- Driven Configuration :
- Low-Side
- Mount :
- Through Hole
- Terminal Finish :
- Matte Tin (Sn)
- Max Output Current :
- 9A
- Current - Peak Output (Source, Sink) :
- 9A 9A
- Reach Compliance Code :
- not_compliant
- Time@Peak Reflow Temperature-Max (s) :
- 35
- Turn On Time :
- 0.04 µs
- Product Status :
- Obsolete
- Number of Terminations :
- 8
- Output Peak Current Limit-Nom :
- 9A
- Operating Temperature :
- -55°C~150°C TJ
- Number of Functions :
- 1
- Temperature Grade :
- Military
- Nominal Supply Current :
- 3mA
- Mounting Type :
- Through Hole
- Number of Terminals :
- 8
- Interface IC Type :
- BUFFER OR INVERTER BASED MOSFET DRIVER
- RoHS Status :
- RoHS Compliant
- Qualification Status :
- Not Qualified
- Width :
- 7.62mm
- Packaging :
- Tube
- Input Type :
- Non-Inverting
- Series :
- --
- Package :
- Tube
- Channel Type :
- Single
- Seated Height-Max :
- 4.57 mm
- Voltage - Supply :
- 4.5V~35V
- Propagation Delay :
- 40 ns
- Supply Voltage :
- 18V
- Fall Time (Typ) :
- 15 ns
- Surface Mount :
- No
- Package Shape :
- RECTANGULAR
- High Side Driver :
- No
- Terminal Pitch :
- 2.54mm
- Turn Off Time :
- 0.036 μs
- Rise Time :
- 15ns
- Terminal Form :
- THROUGH-HOLE
- Base Part Number :
- IXD*409
- Turn On Delay Time :
- 40 ps
- Supplier Device Package :
- 8-PDIP
- Logic Voltage - VIL, VIH :
- 0.8V 3.5V
- JESD-609 Code :
- e3
- Weight :
- 599.989307mg
- Length :
- 9.59mm
- Rise / Fall Time (Typ) :
- 10ns 10ns
- Lead Free :
- Lead Free
- JESD-30 Code :
- R-PDIP-T8
- Manufacturer :
- IXYS Corporation
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Position :
- Dual
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Gate Type :
- IGBT, N-Channel, P-Channel MOSFET
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- ECCN Code :
- EAR99
- Number of Drivers :
- 1
- Output Current :
- 9A
- Height Seated (Max) :
- 4.57mm
- Pin Count :
- 8
- Base Product Number :
- IXDN409
- Number of Pins :
- 8
- Datasheets
- IXDN409PI

Gate Drivers Littelfuse IXDN409PI Overview
Introducing the Gate Drivers Littelfuse IXDN409PI, an essential component for professionals seeking robust and reliable low-side gate driving solutions. Manufactured by Littelfuse, this IC gate driver is designed to efficiently manage power and switching in electronic circuits. Encased in an 8DIP package, it offers a streamlined integration into existing layouts, making it an ideal choice for high-performance applications. Its ability to drive MOSFETs and IGBTs with precision ensures optimal functioning of your electronic assemblies, promoting enhanced system reliability and performance.
IXDN409PI Features
The IXDN409PI gate driver is packed with features designed for high-efficiency and durable operation. Key attributes include its low drive impedance and fast switching capabilities, which help in reducing transition losses. The device also supports a wide range of input logic levels, making it versatile across various digital interfaces. Additionally, its built-in protection against over-current provides further reliability and safety, making it a trustworthy choice for critical applications.
IXDN409PI Applications
- Motor Control Systems: Utilizes its fast switching capabilities to enhance performance and efficiency in electric motor drivers.
- Power Converters: Provides reliable gate driving for MOSFETs and IGBTs used in DC-DC and AC-DC converters, ensuring stable operation.
- Renewable Energy Systems: Employs robust gate driving in solar inverters and wind turbine converters, optimizing energy conversion and grid performance.
- Automotive Applications: Drives components in electric vehicle powertrain systems, supporting advancements in automotive efficiency and emissions reductions.
- LED Lighting Systems: Used in high-power LED lighting setups, improving energy efficiency and reducing thermal footprint.
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