LFE2M70E-5F900C
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- Mfr.Part #
- LFE2M70E-5F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 416 I/O 900FBGA
- Stock
- 42,420
- In Stock ：
- 42,420
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 1.2V
- RAM Size :
- 566.8kB
- Number of Pins :
- 900
- Published :
- 2012
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Height Seated (Max) :
- 2.6mm
- Combinatorial Delay of a CLB-Max :
- 0.358 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Pin Count :
- 900
- Number of Outputs :
- 416
- Total RAM Bits :
- 4642816
- Pbfree Code :
- No
- Package / Case :
- 900-BBGA
- Peak Reflow Temperature (Cel) :
- 225
- Base Part Number :
- LFE2M70
- Max Frequency :
- 311MHz
- Number of Logic Cells :
- 70000
- Series :
- ECP2M
- RoHS Status :
- Non-RoHS Compliant
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 1.14V~1.26V
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e0
- HTS Code :
- 8542.39.00.01
- Number of I/O :
- 416
- Operating Supply Voltage :
- 1.2V
- ECCN Code :
- EAR99
- Number of Logic Elements/Cells :
- 67000
- Memory Size :
- 584.9kB
- Terminal Form :
- Ball
- Width :
- 31mm
- Operating Temperature :
- 0°C~85°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Number of Terminations :
- 900
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Length :
- 31mm
- Lead Free :
- Lead Free
- Number of LABs/CLBs :
- 8375
- Datasheets
- LFE2M70E-5F900C
FPGAs Lattice Semiconductor LFE2M70E-5F900C Overview
The LFE2M70E-5F900C, a high-performance FPGA from Lattice Semiconductor, is designed to meet the demanding requirements of advanced digital processing applications. This FPGA offers a flexible solution with its vast I/O capabilities and substantial logic density, making it an excellent choice for designers looking to leverage speed and integration in compact form factors. With its 900FBGA packaging, the LFE2M70E-5F900C integrates easily into various design architectures, providing a robust platform for developing sophisticated systems. The use of this FPGA can significantly accelerate time-to-market for products requiring high-speed data processing and intricate algorithm implementations.
LFE2M70E-5F900C Features
This FPGA boasts 416 I/O pins, allowing extensive connectivity and flexibility in system design. Its 900FBGA package is optimal for achieving high-density configurations while maintaining a compact footprint. The device's high-performance capabilities make it suitable for complex digital computations, signal processing, and power management tasks in both industrial and commercial applications.
LFE2M70E-5F900C Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and other network equipment to manage data flow efficiently and support high-speed communications.
- Automotive Systems: Deployed in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, enhancing safety and driver experience.
- Industrial Automation: Critical in control systems for real-time monitoring and automation of industrial processes, improving operational efficiency and reliability.
- Consumer Electronics: Used in high-definition multimedia interfaces and virtual reality systems, providing the necessary processing power for enhanced user experiences.
- Medical Devices: Integral in diagnostic and imaging equipment, enabling complex data analysis and supporting advancements in medical technology.
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