LFEC10E-3F256C

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Mfr.Part #
LFEC10E-3F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 195 I/O 256FBGA
Stock
8,949
In Stock :
8,949

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
0°C~85°C TJ
Lead Free :
Lead Free
Packaging :
Tray
Number of Pins :
256
Mount :
Surface Mount
Number of Outputs :
195
Power Supplies :
1.21.2/3.33.3V
Series :
EC
Max Frequency :
340MHz
Base Part Number :
LFEC10
Terminal Finish :
Tin/Lead (Sn63Pb37)
ECCN Code :
EAR99
Length :
17mm
Pbfree Code :
No
Height Seated (Max) :
2.1mm
Peak Reflow Temperature (Cel) :
225
Memory Size :
39.6kB
Supply Voltage :
1.2V
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Reach Compliance Code :
not_compliant
Total RAM Bits :
282624
Terminal Position :
BOTTOM
Time@Peak Reflow Temperature-Max (s) :
30
Pin Count :
256
Number of Logic Blocks (LABs) :
1280
Number of Logic Elements/Cells :
10200
Number of I/O :
195
Combinatorial Delay of a CLB-Max :
0.56 ns
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
1.14V~1.26V
Mounting Type :
Surface Mount
Package / Case :
256-BGA
Published :
2004
RoHS Status :
Non-RoHS Compliant
JESD-609 Code :
e0
Number of Terminations :
256
Terminal Pitch :
1mm
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Supply Voltage :
1.2V
RAM Size :
34.5kB
Width :
17mm
Datasheets
LFEC10E-3F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-3F256C from Xinshop,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Pins:256, Base Part Number:LFEC10, Mounting Type:Surface Mount, Package / Case:256-BGA, Number of Terminations:256, LFEC10E-3F256C pinout, LFEC10E-3F256C datasheet PDF, LFEC10E-3F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC10E-3F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC10E-3F256C


FPGAs Lattice Semiconductor LFEC10E-3F256C Overview

The Lattice Semiconductor LFEC10E-3F256C FPGA represents a superior blend of utility and performance in the field of programmable logic devices. Designed for versatile applications, this FPGA from Lattice Semiconductor features a compact 256FBGA (Fine Pitch Ball Grid Array) package, making it suitable for dense board layouts where space is at a premium. With 195 I/Os, it provides ample connectivity for various peripheral integrations, supporting complex digital systems. The FPGA’s robust design and adaptive configuration abilities make it ideal for developers looking to customize their applications, providing both flexibility and power efficiency.

LFEC10E-3F256C Features

This FPGA module offers essential characteristics that are critical for high-performance computing tasks in a variety of settings. Key features of the LFEC10E-3F256C include:

  • High I/O count (195 I/O pins) for versatile peripheral connections and system expansions.
  • Compact 256FBGA package, optimized for reduced space consumption on PCBs.
  • Flexible programmability to cater to specific application needs, enhancing system efficiency and performance.
  • Robust design suitable for industrial-grade applications requiring high reliability and durability.

LFEC10E-3F256C Applications

  • Consumer Electronics: Utilized in devices like smart TVs and gaming consoles where multiple input/output connections are essential for enhanced functionality.
  • Automotive Systems: Can be integrated into automotive infotainment systems, aiding in managing complex user interfaces and connectivity solutions.
  • Industrial Automation: Serves as a control unit in automated machinery, providing the necessary computing power and I/O capabilities to handle multiple control tasks simultaneously.
  • Telecommunications: Ideal for use in communication infrastructure, supporting the management of data flow and signal processing.
  • Healthcare Devices: Applied in medical imaging systems, where high data throughput and precise control over processing tasks are paramount.
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