XC17S50APDG8C

Manufacturer :

AMD Xilinx

Product Category :

Configuration Proms for FPGAs

Supply Voltage :

3.3V

Operating Supply Voltage :

3.3V

Package / Case :

8-DIP (0.300, 7.62mm)

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Standby Current-Max :

0.001A

Peak Reflow Temperature (Cel) :

250

Voltage - Supply :

3V~3.6V

Terminal Position :

Dual

Packaging :

Tube

Pin Count :

8

Memory Size :

500kb

Terminal Pitch :

2.54mm

I/O Type :

COMMON

Memory Width :

1

Programmable Type :

OTP

Supply Voltage-Max (Vsup) :

3.6V

Published :

1999

Output Characteristics :

3-STATE

Operating Temperature :

0°C~70°C

Terminal Finish :

Matte Tin (Sn)

Surface Mount :

No

Base Part Number :

XC17S50A

Width :

7.62mm

Time@Peak Reflow Temperature-Max (s) :

30

Memory IC Type :

CONFIGURATION MEMORY

Density :

1 Mb

Mounting Type :

Through Hole

Pbfree Code :

yes

Number of Pins :

8

Number of Functions :

1

Supply Current-Max :

0.015mA

Radiation Hardening :

No

Supply Voltage-Min (Vsup) :

3V

JESD-609 Code :

e3

Parallel/Serial :

Serial

ECCN Code :

EAR99

Organization :

559200X1

RoHS Status :

RoHS Compliant

Length :

9.3599mm

Height Seated (Max) :

4.5974mm

Number of Terminations :

8