10081530-11138ELF

Manufacturer :

Amphenol Communications Solutions

Product Category :

Inline Module Sockets

Termination Type :

Solder

Mating Contact Pitch :

0.039 inch

Connector Style :

RDIMM

Number of Rows :

2

Number Of PCB Rows :

4

Insulation Resistance :

1000000Ohm

Contact Finish Thickness :

30.0μin 0.76μm

Factory Lead Time :

11 Weeks

JESD-609 Code :

e3

Terminal Pitch :

0.079mm

Insulation Material :

GLASS FILLED THERMOPLASTIC

Contact Material :

COPPER ALLOY

Memory Type :

DDR3 SDRAM

Rated Current (Signal) :

0.75A

Contact Style :

BELLOWED TYPE

Body/Shell Style :

Receptacle

Contact Finish :

Gold

Body Length or Diameter :

5.551 inch

Pbfree Code :

yes

Durability :

25 Cycles

Standards :

MO-269

Total Number of Contacts :

240

Dielectric Withstanding Voltage :

500VAC V

Polarization Key :

POLARIZED HOUSING

Length - Termination :

0.105 inch

Contact Resistance :

10MOhm

Body Breadth :

0.299 inch

Packaging :

Tray

Plating Thickness :

30μin

PCB Contact Row Spacing :

1.905 mm

Feature :

Board Lock, Latches

Operating Temperature (Max) :

85°C

Mounting Feature :

Normal, Standard - Top

Mounting Type :

Through Hole

HTS Code :

8536.69.40.40

RoHS Status :

RoHS Compliant

Operating Temperature (Min) :

-55°C

Published :

2014

Number of Positions :

240

ECCN Code :

EAR99

Reliability :

COMMERCIAL

Insulator Color :

Black

Reference Standard :

UL

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Number of Conductors :

ONE

Mount :

Through Hole

PCB Contact Pattern :

STAGGERED