70T633S10BF

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Mfr.Part #
70T633S10BF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
208-LFBGA
Datasheet
Download
Description
IC SRAM 9MBIT PARALLEL 208CABGA
Stock
29,341
In Stock :
29,341

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Operating Temperature :
0°C~70°C TA
Voltage - Supply :
2.4V~2.6V
Write Cycle Time - Word, Page :
10ns
Memory Size :
9Mb 512K x 18
Memory Interface :
Parallel
Memory Format :
SRAM
Base Part Number :
IDT70T633
Mounting Type :
Surface Mount
RoHS Status :
Non-RoHS Compliant
Package / Case :
208-LFBGA
Factory Lead Time :
12 Weeks
Packaging :
Tray
Memory Type :
Volatile
Datasheets
70T633S10BF
Introducing Memory Intersil (Renesas Electronics Corporation) 70T633S10BF from Xinshop,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~70°C TA, Base Part Number:IDT70T633, Mounting Type:Surface Mount, Package / Case:208-LFBGA, 70T633S10BF pinout, 70T633S10BF datasheet PDF, 70T633S10BF amp .Beyond Memory Intersil (Renesas Electronics Corporation) 70T633S10BF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) 70T633S10BF


Memory Intersil (Renesas Electronics Corporation) 70T633S10BF Overview

The Memory Intersil (Renesas Electronics Corporation) 70T633S10BF is a high-performance 9Mbit SRAM component, housed in a compact 208-CABGA package. Designed to meet the demands of high-speed data environments, this IC offers a robust parallel interface, making it ideal for applications requiring quick and reliable access to large volumes of data. Its advanced design ensures low power consumption and high stability, making it a preferred choice for developers and engineers seeking efficient, scalable memory solutions. With its significant storage capacity and the backing of Renesas' renowned manufacturing expertise, the 70T633S10BF is positioned to significantly boost the performance of advanced electronic systems.

70T633S10BF Features

This SRAM chip includes several key features that make it suitable for a wide range of demanding applications. Key attributes include a large 9MBit capacity, a parallel interface for rapid data access and throughput, and a durable 208-CABGA package that ensures reliability and longevity in complex circuit designs. Additionally, its low-power operation helps maintain the efficiency of the overall system, reducing the thermal footprint and enhancing system stability.

70T633S10BF Applications

  • Networking Equipment: Utilized in routers, switches, and network controllers for buffering data during high-speed data transmission.
  • Telecommunications Infrastructure: Supports the high-speed, high-volume data handling required in telecommunications systems.
  • Industrial Automation: Helps in managing complex operations and real-time data processing in automation and control systems.
  • Medical Devices: Applied in sophisticated medical imaging and diagnostics equipment, ensuring rapid data processing and reliability.
  • Aerospace and Defense: Used in systems requiring rugged, high-capacity memory for mission-critical applications.
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