808-AG11D-LF
- Mfr.Part #
- 808-AG11D-LF
- Manufacturer
- TE Connectivity AMP Connectors
- Package / Case
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 8POS GOLD
- Stock
- 2,657
- In Stock :
- 2,657
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- Manufacturer :
- TE Connectivity AMP Connectors
- Product Category :
- IC Sockets
- PCB Contact Row Spacing :
- 0.3 mm
- Series :
- 800
- Contact Material - Mating :
- BERYLLIUM COPPER
- Current Rating :
- 3A
- Body Breadth :
- 0.4 inch
- Packaging :
- Tube
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Contacts :
- 8
- Termination Post Length :
- 0.125 3.18mm
- Operating Temperature :
- -55°C~105°C
- Contact Resistance :
- 10MOhm
- Material Flammability Rating :
- UL94 V-0
- HTS Code :
- 8536.69.40.40
- Contact Finish Thickness - Mating :
- 25.0μin 0.63μm
- Termination :
- Solder
- Contact Finish - Mating :
- Gold
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Body Length or Diameter :
- 0.4 inch
- Dielectric Withstanding Voltage :
- 1000VAC V
- Type :
- DIP, 0.3 (7.62mm) Row Spacing
- Mounting Type :
- Through Hole
- Feature :
- Open Frame
- Published :
- 2005
- Contact Style :
- Machine Screw
- Housing Material :
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Contact Finish Thickness - Post :
- 25.0μin 0.63μm
- Insulation Resistance :
- 5000000000Ohm
- ECCN Code :
- EAR99
- Contact Material - Post :
- Copper
- Reach Compliance Code :
- not_compliant
- Body Depth :
- 0.18 inch
- Terminal Pitch :
- 2.54mm
- RoHS Status :
- RoHS Compliant
- Factory Lead Time :
- 9 Weeks
- Mating Contact Pitch :
- 0.1 inch
- Pitch - Post :
- 0.100 2.54mm
- PCB Contact Pattern :
- RECTANGULAR
- Pitch - Mating :
- 0.100 2.54mm
- Datasheets
- 808-AG11D-LF

808-AG11D-LF datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity AMP Connectors stock available at Xinshop
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