A2F500M3G-FG256I
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- Mfr.Part #
- A2F500M3G-FG256I
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 80MHZ 256FBGA
- Stock
- 21,922
- In Stock ：
- 21,922
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Height Seated (Max) :
- 1.7mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- A2F500M3G
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Core Processor :
- ARM® Cortex®-M3
- Number of Logic Blocks (LABs) :
- 24
- Number of Pins :
- 256
- Supply Voltage-Max (Vsup) :
- 1.575V
- Terminal Position :
- BOTTOM
- Supply Voltage-Min (Vsup) :
- 1.425V
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- -40°C~100°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 20
- Peak Reflow Temperature (Cel) :
- 225
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Interface :
- EBI/EMI, Ethernet, I2C, SPI, UART, USART
- Published :
- 2015
- Flash Size :
- 512kB
- Supply Voltage :
- 1.5V
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Surface Mount :
- yes
- Architecture :
- MCU, FPGA
- Frequency :
- 80MHz
- Length :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 17mm
- Operating Supply Current :
- 2mA
- Number of I/O :
- MCU - 25, FPGA - 66
- Core Architecture :
- ARM
- Factory Lead Time :
- 12 Weeks
- Terminal Form :
- Ball
- Power Supplies :
- 1.51.82.53.3V
- Peripherals :
- DMA, POR, WDT
- RAM Size :
- 64KB
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Primary Attributes :
- ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Package / Case :
- 256-LBGA
- Series :
- SmartFusion®
- Number of Terminations :
- 256
- Number of Outputs :
- 66
- JESD-609 Code :
- e0
- Number of Gates :
- 500000
- Datasheets
- A2F500M3G-FG256I
256 Terminations -40°C~100°C TJ 256 Pin A2F500M3G System On Chip SmartFusion® Series MCU - 25, FPGA - 66 I/O 1.5V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion® series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has MCU - 25, FPGA - 66 I/Os.Use a power supply with a voltage of 1.5V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.575V.Power supplies of at least 1.425V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 256 terminations.A SoC chip like this can have 66 outputs.In order to operate system on chip, you will need 1.51.82.53.3V power supplies.A flashing 512KB appears on it.Searching A2F500M3G will bring up system on chips with similar specs and purposes.At 80MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.The computer SoC is the 256-pin version.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F500M3G-FG256I System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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