BU7831KN-E2

- Mfr.Part #
- BU7831KN-E2
- Manufacturer
- ROHM Semiconductor
- Package / Case
- 20-VFQFN
- Datasheet
- Download
- Description
- IC FULLY INTEG PROCESSOR 20VQFN
- Stock
- 2





- In Stock :
- 2
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- Manufacturer :
- ROHM Semiconductor
- Product Category :
- Audio Special Purpose
- RoHS Status :
- ROHS3 Compliant
- Length :
- 4.2mm
- Contact Plating :
- Copper, Tin
- Supply Voltage-Max (Vsup) :
- 3.3V
- Interface :
- Serial
- Base Part Number :
- BU7831
- Supply Current-Max :
- 3.7mA
- Terminal Pitch :
- 0.5mm
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage-Min (Vsup) :
- 2.5V
- Consumer IC Type :
- CONSUMER CIRCUIT
- Factory Lead Time :
- 8 Weeks
- Function :
- Fully Integrated Processor
- Published :
- 2005
- Radiation Hardening :
- No
- Package / Case :
- 20-VFQFN
- Width :
- 4.2mm
- Power Supplies :
- 3V
- Terminal Position :
- QUAD
- Number of Terminations :
- 20
- Mount :
- Surface Mount
- Applications :
- Consumer Audio
- Voltage - Supply :
- 2.5V~3.3V
- Number of Pins :
- 20
- Mounting Type :
- Surface Mount
- Number of Channels :
- 6
- Packaging :
- Tape and Reel (TR)
- HTS Code :
- 8542.39.00.01
- Height Seated (Max) :
- 1mm
- Operating Temperature :
- -30°C~85°C TA
- Datasheets
- BU7831KN-E2

Audio Special Purpose ROHM Semiconductor BU7831KN-E2 Overview
The BU7831KN-E2, crafted by ROHM Semiconductor, is a fully integrated processor designed to cater to high-performance audio applications. This versatile IC is encased in a compact 20-VQFN package, making it ideal for streamlined, space-conscious designs. As an integral component within the Audio Special Purpose category, the BU7831KN-E2 stands out for its robust design and versatility, offering unmatched efficiency and reliability in audio processing. By integrating advanced features and a scalable architecture, this IC meets the evolving demands of modern audio systems, ensuring superior sound quality and system integration.
BU7831KN-E2 Features
This fully integrated processor boasts a range of features designed to enhance audio system performance, including advanced signal processing capabilities, low power consumption, and a high degree of integration which simplifies the overall design and reduces time to market for audio applications. The compact 20-VQFN package also ensures that the IC can be incorporated into various design architectures without compromising on performance.
BU7831KN-E2 Applications
- Portable Audio Devices: Employs its compact size and efficient power usage to enhance audio playback quality in devices such as wireless speakers and portable music players.
- Home Audio Systems: Utilizes advanced audio processing to deliver clearer, more robust sound in home theater systems and hi-fi components.
- Automotive Audio Systems: Provides reliable, high-fidelity sound processing for in-car entertainment systems, ensuring durable performance under varying environmental conditions.
- Smart Home Devices: Integrates seamlessly into smart home ecosystems, offering enhanced audio interaction capabilities for devices like smart speakers and IoT hubs.
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