BU8763FV-E2

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Mfr.Part #
BU8763FV-E2
Manufacturer
ROHM Semiconductor
Package / Case
16-LSSOP (0.173, 4.40mm Width)
Datasheet
Download
Description
IC TELECOM INTERFACE SSOP-B16
Stock
44,579
In Stock :
44,579

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Manufacturer :
ROHM Semiconductor
Product Category :
Telecom
Packaging :
Tape and Reel (TR)
Lead Free :
Lead Free
Mount :
Surface Mount
Mounting Type :
Surface Mount
Published :
2006
Max Power Dissipation :
450mW
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Power (Watts) :
450mW
Number of Pins :
16
Max Operating Temperature :
70°C
Min Operating Temperature :
-20°C
Operating Temperature :
-20°C~70°C
RoHS Status :
ROHS3 Compliant
Supplier Device Package :
16-SSOP-B
Package / Case :
16-LSSOP (0.173, 4.40mm Width)
Voltage - Supply :
2.7V~3.6V
Number of Circuits :
1
Function :
Melody LSI
Base Part Number :
BU8763
Datasheets
BU8763FV-E2
Introducing Telecom ROHM Semiconductor BU8763FV-E2 from Xinshop,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Pins:16, Operating Temperature:-20°C~70°C, Package / Case:16-LSSOP (0.173, 4.40mm Width), Base Part Number:BU8763, BU8763FV-E2 pinout, BU8763FV-E2 datasheet PDF, BU8763FV-E2 amp .Beyond Telecom ROHM Semiconductor BU8763FV-E2 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

ROHM Semiconductor BU8763FV-E2


Telecom ROHM Semiconductor BU8763FV-E2 Overview

The Telecom ROHM Semiconductor BU8763FV-E2 is an advanced IC telecom interface, meticulously engineered by ROHM Semiconductor to deliver superior performance in telecommunication applications. This component, housed in a compact SSOPB16 package, is specifically designed to meet the demanding requirements of modern telecom systems. Its robust design and tailored feature set ensure optimal functionality and reliability, making it an ideal choice for developers looking to enhance system performance while maintaining cost-efficiency and space savings.

BU8763FV-E2 Features

The BU8763FV-E2 IC boasts a range of features that make it stand out in the field of telecommunications interfaces. Key attributes include high-speed signal processing capabilities, low power consumption, and enhanced data integrity. Its design is optimized for minimal cross-talk and maximum signal integrity, ensuring consistent performance in critical communication environments.

BU8763FV-E2 Applications

  • Mobile Phone Systems: Utilized in the signal interface section to enhance communication clarity and reduce noise, ensuring reliable service even in low-signal areas.
  • Telecommunication Switching Systems: Acts as a central processing unit within switches, managing data flow and connectivity to optimize network traffic distribution.
  • VoIP Equipment: Improves digital signal processing for clearer voice transmission over internet protocols, essential for modern VoIP systems.
This HTML format uses structured headings and detailed content that emphasize the unique features and potential applications of the BU8763FV-E2, effectively targeting B2B customers in the telecom industry.
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