BZB84-B15215

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Max Power Dissipation :

300mW

JESD-609 Code :

e3

Power Dissipation :

300mW

Number of Elements :

2

Voltage - Forward (Vf) (Max) @ If :

900mV @ 10mA

Published :

2009

Impedance-Max :

30Ohm

Polarity :

Unidirectional

Contact Plating :

Tin

HTS Code :

8541.10.00.50

Tolerance :

±2%

ECCN Code :

EAR99

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Peak Reflow Temperature (Cel) :

260

ESD Protection :

No

Diode Element Material :

SILICON

Voltage Tol-Max :

2%

Voltage Tolerance :

2%

Mounting Type :

Surface Mount

Factory Lead Time :

4 Weeks

Max Operating Temperature :

150°C

Test Current :

5mA

Diode Type :

ZENER DIODE

Pin Count :

3

Current - Reverse Leakage @ Vr :

50nA @ 10.5V

Package / Case :

TO-236-3, SC-59, SOT-23-3

Packaging :

Tape and Reel (TR)

Impedance :

30Ohm

RoHS Status :

ROHS3 Compliant

Number of Terminations :

3

Mount :

Surface Mount

Number of Pins :

3

Time@Peak Reflow Temperature-Max (s) :

30

Element Configuration :

Common Anode

Max Reverse Leakage Current :

50nA

Zener Voltage :

15V

Terminal Form :

Gull wing

Terminal Position :

Dual

Configuration :

1 Pair Common Anode

Reference Voltage :

15V