CYD36S36V18-133BBXC
- Mfr.Part #
- CYD36S36V18-133BBXC
- Manufacturer
- Infineon Technologies
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SRAM 36MBIT PARALLEL 256FBGA
- Stock
- 35,746
- In Stock :
- 35,746
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Memory
- Memory Interface :
- Parallel
- Number of Pins :
- 256
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- JESD-30 Code :
- S-PBGA-B484
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage-Max (Vsup) :
- 1.58V
- Access Time :
- 133 μs
- Package / Case :
- 256-LBGA
- Address Bus Width :
- 40b
- Number of Ports :
- 2
- Qualification Status :
- Not Qualified
- Lead Free :
- Lead Free
- Memory Type :
- Volatile
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.5V
- Base Part Number :
- CYD36S36
- Published :
- 2006
- Clock Frequency :
- 133MHz
- Number of Terminations :
- 484
- Number of Functions :
- 1
- Surface Mount :
- yes
- JESD-609 Code :
- e1
- Packaging :
- Tray
- Memory Size :
- 36Mb 1M x 36
- Density :
- 36 Mb
- Memory Format :
- SRAM
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Pin Count :
- 484
- Voltage - Supply :
- 1.42V~1.58V 1.7V~1.9V
- Memory Width :
- 36
- Operating Temperature :
- 0°C~70°C TA
- Organization :
- 1MX36
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- Operating Supply Voltage :
- 1.8V
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Datasheets
- CYD36S36V18-133BBXC

Memory Infineon Technologies CYD36S36V18-133BBXC Overview
The Memory Infineon Technologies CYD36S36V18-133BBXC is a cutting-edge SRAM device offering a substantial 36Mbit of storage capacity, tailored for applications requiring high-speed, reliable data access and storage. Engineered by Infineon Technologies, this memory module utilizes a parallel interface encapsulated in a compact 256FBGA package, ensuring efficient integration into modern electronic systems. Its robust design and advanced technology make it ideal for a wide range of industrial and commercial applications, promoting enhanced system performance and reliability.
CYD36S36V18-133BBXC Features
The CYD36S36V18-133BBXC SRAM features a 36Mbit capacity with a parallel interface, providing rapid access and high throughput for data-intensive applications. Its 256FBGA package is designed for optimal space efficiency and reduced power consumption, making it suitable for densely packed circuit designs. Additionally, this IC is known for its durability and ability to operate under extended temperature ranges, ensuring reliable performance across various environmental conditions.
CYD36S36V18-133BBXC Applications
- High-Performance Computing: Utilized in server and supercomputing environments to accelerate processing speeds by caching large datasets close to the processor, enhancing overall system efficiency.
- Networking Equipment: Employs in routers and switches to facilitate swift data buffer management, crucial for maintaining high-speed network performance and reliability.
- Telecommunications: Integrated into telecom infrastructure to provide fast and reliable data caching, supporting high-demand communication technologies and services.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to handle real-time data processing, improving vehicle response times and safety features.
- Industrial Automation: Applied in automated control systems for rapid task execution and real-time system monitoring, boosting operational efficiency and precision in complex industrial environments.
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