DS3174N+
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- Mfr.Part #
- DS3174N+
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 349-BBGA, CSBGA Exposed Pad
- Datasheet
- Download
- Description
- IC TELECOM INTERFACE 400BGA
- Stock
- 38,778
- In Stock ：
- 38,778
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Telecom
- Surface Mount :
- yes
- Number of Terminations :
- 400
- JESD-609 Code :
- e1
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- 260
- Pbfree Code :
- yes
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -40°C~85°C
- Voltage - Supply :
- 3.135V~3.465V
- Qualification Status :
- Not Qualified
- Published :
- 2006
- Base Part Number :
- DS3174
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Interface :
- DS3, E3
- ECCN Code :
- EAR99
- Terminal Pitch :
- 1.27mm
- Function :
- Single-Chip Transceiver
- Moisture Sensitivity Level (MSL) :
- 5 (48 Hours)
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 3.3V
- Current - Supply :
- 725mA
- Package / Case :
- 349-BBGA, CSBGA Exposed Pad
- Telecom IC Type :
- Framer
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Width :
- 27mm
- Terminal Position :
- BOTTOM
- Number of Circuits :
- 4
- Power Supplies :
- 3.3V
- Packaging :
- Tray
- Length :
- 27mm
- Datasheets
- DS3174N+
Telecom Analog Devices, Inc. DS3174N+ Overview
The DS3174N+ from Analog Devices, Inc. is a highly sophisticated IC designed for telecom interfaces, housed in a robust 400-BGA package. This advanced component is engineered to facilitate reliable and high-speed data and voice communications across various telecommunications networks. With its integration capabilities, the DS3174N+ ensures seamless interface operations, making it a critical component for developers looking to enhance network efficiency and communication reliability. The inclusion of this IC in your systems promises enhanced performance, crucial for handling modern telecom demands, thereby assisting businesses in scaling their communication infrastructure to meet emerging technological trends.
DS3174N+ Features
This IC offers a comprehensive range of features designed to support complex telecom systems. It provides robust data handling capabilities suitable for high-speed telecom operations. The compact 400-BGA packaging not only ensures a minimal footprint on telecom boards but also facilitates better thermal management and reliability under various operational conditions.
DS3174N+ Applications
- High-Speed Network Systems: Utilized in backbone network hardware to manage and facilitate high-speed data transmission efficiently.
- Telecommunication Switching Systems: Acts as a core component in switches and routers, improving the handling of voice and multimedia transmissions.
- Wireless Base Stations: Critical for enhancing the data throughput and reliability of wireless communications systems.
- Enterprise Networking: Supports enterprise-level telecom solutions, including VoIP systems, to ensure uninterrupted and high-quality communication across corporate networks.
- Broadband Access Equipment: Applied in equipment that provides broadband internet to enhance connectivity and speed, crucial for modern internet services.
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