EP1C4F324C7

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Mfr.Part #
EP1C4F324C7
Manufacturer
Altera (Intel)
Package / Case
324-BGA
Datasheet
Download
Description
IC FPGA 249 I/O 324FBGA
Stock
644
In Stock :
644

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
1mm
Surface Mount :
yes
Height Seated (Max) :
2.2mm
Peak Reflow Temperature (Cel) :
220
Width :
19mm
Total RAM Bits :
78336
Supply Voltage :
1.5V
Number of Logic Elements/Cells :
4000
Number of I/O :
249
Voltage - Supply :
1.425V~1.575V
Package / Case :
324-BGA
Terminal Form :
Ball
Number of LABs/CLBs :
400
Packaging :
Tray
Base Part Number :
EP1C4
Number of Outputs :
301
Mounting Type :
Surface Mount
Series :
Cyclone®
Power Supplies :
1.51.5/3.3V
JESD-609 Code :
e0
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
HTS Code :
8542.39.00.01
Terminal Position :
BOTTOM
Number of Terminations :
324
JESD-30 Code :
S-PBGA-B324
Operating Temperature :
0°C~85°C TJ
Terminal Finish :
Tin/Lead (Sn/Pb)
Clock Frequency :
320MHz
RoHS Status :
Non-RoHS Compliant
Qualification Status :
Not Qualified
Number of Inputs :
301
Length :
19mm
Time@Peak Reflow Temperature-Max (s) :
30
Datasheets
EP1C4F324C7
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 from Xinshop,where excellence meets affordability. This product stands out with its Package / Case:324-BGA, Base Part Number:EP1C4, Mounting Type:Surface Mount, Number of Terminations:324, Operating Temperature:0°C~85°C TJ, EP1C4F324C7 pinout, EP1C4F324C7 datasheet PDF, EP1C4F324C7 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP1C4F324C7


FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) EP1C4F324C7 represents a cornerstone in advanced integrated circuit technology by Intel. Engineered to deliver exceptional performance, this FPGA leverages the robust 324-pin FBGA (Fine-pitch Ball Grid Array) packaging to achieve superior integration and scalability. As a product designed to handle complex digital computations, it is ideally suited for applications that require high-speed signal processing and data management. Its versatility is further enhanced by a high count of 249 I/Os, making it a pivotal solution for developers aiming to build high-performance systems in telecommunications, automotive, and industrial sectors.

EP1C4F324C7 Features

This FPGA stands out with its extensive set of features which include a high I/O pin count of 249, providing ample flexibility for complex designs. The 324FBGA packaging not only ensures a compact footprint but also enhances thermal management and device reliability under varying operational conditions. These characteristics make the EP1C4F324C7 an ideal choice for designers seeking advanced capabilities in hardware acceleration and system integration.

EP1C4F324C7 Applications

  • Telecommunications Equipment: Utilizes its high I/O capacity and processing power to manage data flows and signal processing, enhancing bandwidth and reducing latency in networks.
  • Automotive Electronics: Applied in driver assistance systems, it supports real-time sensor data processing and integration, contributing to safer and smarter vehicle functionalities.
  • Industrial Automation: Drives complex control systems and machinery by performing rapid computations and reliable operations in harsh environments.
  • Consumer Electronics: Powers devices requiring fast processing capabilities, such as smart home devices and high-definition multimedia interfaces.
  • Medical Devices: Used in diagnostic and monitoring equipment, ensuring precise control and processing for critical healthcare applications.
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