EP1S30F780C6DM

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Mfr.Part #
EP1S30F780C6DM
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 597 I/O 780FBGA
Stock
46,923
In Stock :
46,923

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Stratix®
Packaging :
Tray
Mounting Type :
Surface Mount
Number of Logic Elements/Cells :
32470
Supplier Device Package :
780-FBGA (29x29)
Voltage - Supply :
1.425V~1.575V
Number of LABs/CLBs :
3247
Total RAM Bits :
3317184
Operating Temperature :
0°C~85°C TJ
Number of I/O :
597
Package / Case :
780-BBGA, FCBGA
Datasheets
EP1S30F780C6DM
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP1S30F780C6DM from Xinshop,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:0°C~85°C TJ, Package / Case:780-BBGA, FCBGA, EP1S30F780C6DM pinout, EP1S30F780C6DM datasheet PDF, EP1S30F780C6DM amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP1S30F780C6DM ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP1S30F780C6DM


FPGAs Altera (Intel) EP1S30F780C6DM Overview

As a leading component in the advanced FPGA sector, the EP1S30F780C6DM by Altera (Intel) is engineered to meet the rigorous demands of modern digital circuits. This high-performance IC FPGA supports complex designs with its 597 I/O pins, encapsulated in a robust 780FBGA package, ensuring optimal functionality and reliability. Its versatility makes it ideal for developers aiming to create scalable and power-efficient solutions in a compact footprint. The FPGAs Altera (Intel) EP1S30F780C6DM is designed to provide a strategic advantage in a broad range of applications, making it a crucial asset for businesses aiming to leverage flexible and programmable solutions for rapid product development.

EP1S30F780C6DM Features

This FPGA offers a diverse range of features that enhance its applicability in numerous technological fields. It includes a vast array of logic elements and embedded memory, high I/O pin count, and support for multiple I/O standards, which are essential for interfacing with various digital systems. Additionally, the 780FBGA packaging ensures a minimal footprint while providing substantial thermal management, crucial for maintaining performance stability under load.

EP1S30F780C6DM Applications

  • Data Centers: Utilized in data processing units for its high-speed logic and extensive I/O capabilities, which facilitate rapid data throughput and processing capabilities essential for server applications and network infrastructure.
  • Telecommunications: Essential in telecommunications equipment for signal processing and data transmission, enhancing bandwidth and reducing latency in complex network systems.
  • Automotive: Applied in automotive electronics for control systems and infotainment, providing the necessary computing power and connectivity solutions required for advanced vehicle technologies.
  • Industrial Automation: Used in industrial control systems, this FPGA aids in managing multiple input and output arrangements in machinery, improving efficiency and precision in automation processes.
  • Consumer Electronics: Integral in consumer electronics, such as smart home devices and portable electronics, where flexible programming and high integration are vital for compact and efficient designs.
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