FDG6301N
- Mfr.Part #
- FDG6301N
- Manufacturer
- onsemi
- Package / Case
- 6-TSSOP, SC-88, SOT-363
- Datasheet
- Download
- Description
- MOSFET 2N-CH 25V 0.22A SC70-6
- Stock
- 2,298
- In Stock :
- 2,298
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Width :
- 1.25mm
- REACH SVHC :
- No SVHC
- Current Rating :
- 220mA
- Rds On (Max) @ Id, Vgs :
- 4 Ω @ 220mA, 4.5V
- Operating Temperature :
- -55°C~150°C TJ
- Factory Lead Time :
- 10 Weeks
- Termination :
- SMD/SMT
- Continuous Drain Current (ID) :
- 220mA
- Voltage - Rated DC :
- 25V
- Power Dissipation :
- 300mW
- RoHS Status :
- ROHS3 Compliant
- Transistor Application :
- SWITCHING
- Lead Free :
- Lead Free
- ECCN Code :
- EAR99
- Resistance :
- 4Ohm
- Pbfree Code :
- yes
- Radiation Hardening :
- No
- Fall Time (Typ) :
- 4.5 ns
- Lifecycle Status :
- ACTIVE (Last Updated: 2 days ago)
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- Terminal Form :
- Gull wing
- Length :
- 2mm
- Number of Elements :
- 2
- Turn-Off Delay Time :
- 4 ns
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Mount :
- Surface Mount
- Element Configuration :
- Dual
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Type :
- Surface Mount
- Vgs(th) (Max) @ Id :
- 1.5V @ 250µA
- Number of Pins :
- 6
- Gate Charge (Qg) (Max) @ Vgs :
- 0.4nC @ 4.5V
- Threshold Voltage :
- 850mV
- Number of Terminations :
- 6
- FET Type :
- 2 N-Channel (Dual)
- Contact Plating :
- Tin
- Drain to Source Breakdown Voltage :
- 25V
- Transistor Element Material :
- SILICON
- Height :
- 1.1mm
- Package / Case :
- 6-TSSOP, SC-88, SOT-363
- Rise Time :
- 4.5ns
- JESD-609 Code :
- e3
- Max Junction Temperature (Tj) :
- 150°C
- Gate to Source Voltage (Vgs) :
- 8V
- Turn On Delay Time :
- 5 ns
- Input Capacitance (Ciss) (Max) @ Vds :
- 9.5pF @ 10V
- Packaging :
- Tape and Reel (TR)
- FET Feature :
- Logic Level Gate
- Operating Mode :
- ENHANCEMENT MODE
- Dual Supply Voltage :
- 25V
- Weight :
- 28mg
- Published :
- 1999
- Max Power Dissipation :
- 300mW
- Datasheets
- FDG6301N

FDG6301N datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at
FDG6301N MOSFET Description
Onsemi's patented, high cell density, DMOS technology is used to manufacture the FDG6301N dual N-Channel logic level enhancement MOSFET. This ultra-high-density technique is specifically designed to reduce on-state resistance. This device was created to replace bipolar digital transistors and tiny signal MOSFETs in low voltage applications. The FDG6301N MOSFET is widely renowned for its low drain-on-resistance and durable ESD architecture.
FDG6301N MOSFET Features
-
25 V, 0.22 A continuous, 0.65 A peak
-
Low RDS(ON) = 4 Ω @ VGS= 4.5 V
-
Very low-level gate drive requirements allow direct operation in 3 V circuits (VGS(th) < 1.5 V).
-
Gate-Source Zener for ESD ruggedness
-
Compact industry standard SC70-6 surface mount package
FDG6301N MOSFET Applications
-
High Current, High-Speed Switching
-
Up to 12s Battery Power Tools
-
Buck Converters
-
Power Converters with Multi-Megahertz Operation
-
Three-Phase Bridge for Brushless DC Motor Control
-
Lighting Applications
-
Other Half and Full-Bridge Topologies
-
Off-Line Power Supplies
-
PFC Controllers
-
Adapters
-
Battery Management
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