FIDO2100BGA128IR0
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- Mfr.Part #
- FIDO2100BGA128IR0
- Manufacturer
- Analog Devices, Inc.
- Package / Case
- 128-TFBGA
- Datasheet
- Download
- Description
- IC INTERFACE SPECIALIZED 128BGA
- Stock
- 3,814
- In Stock ：
- 3,814
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- Manufacturer :
- Analog Devices, Inc.
- Product Category :
- Specialized
- Mounting Type :
- Surface Mount
- Lifecycle Status :
- Production (Last Updated: 6 days ago)
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 6 Weeks
- Number of Functions :
- 1
- Package / Case :
- 128-TFBGA
- Peak Reflow Temperature (Cel) :
- 260
- Width :
- 10mm
- Length :
- 10mm
- Mount :
- Surface Mount
- Height Seated (Max) :
- 1.3mm
- Operating Temperature (Min) :
- -40°C
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- ROHS3 Compliant
- Lead Free :
- Lead Free
- Terminal Form :
- Ball
- Supply Voltage :
- 1.8V
- Number of Pins :
- 128
- Pin Count :
- 128
- Pbfree Code :
- No
- Number of Terminations :
- 128
- Terminal Position :
- BOTTOM
- Applications :
- Ethernet
- Terminal Pitch :
- 0.8mm
- Operating Temperature (Max) :
- 85°C
- Voltage - Supply :
- 1.62V~1.98V 3V~3.6V
- Base Part Number :
- FIDO2100
- Temperature Grade :
- Industrial
- Telecom IC Type :
- TELECOM CIRCUIT
- Datasheets
- FIDO2100BGA128IR0
Specialized Analog Devices, Inc. FIDO2100BGA128IR0 Overview
The Specialized Analog Devices, Inc. FIDO2100BGA128IR0 is a cutting-edge IC interface specialized for demanding applications requiring robust data transfer and communication capabilities. Designed to integrate seamlessly into advanced digital networks, this 128-BGA packaged interface chip excels in high-speed data transmission and signal integrity, ensuring reliable and efficient operations. With its state-of-the-art technology, the FIDO2100BGA128IR0 is tailored to meet the rigorous requirements of modern electronic systems, providing both versatility and high performance in a compact form factor.
FIDO2100BGA128IR0 Features
- High-speed interface capabilities ensuring rapid data transfer rates.
- Compact 128-BGA (Ball Grid Array) packaging for reduced space usage on PCBs.
- Enhanced signal integrity for reliable communication in complex electronic systems.
- Optimized for low power consumption, contributing to energy-efficient designs.
- Robust design suitable for harsh industrial environments.
FIDO2100BGA128IR0 Applications
- Industrial Automation: Integrates into control systems for real-time monitoring and management, improving efficiency and reliability.
- Telecommunications: Essential for data centers and network infrastructure, facilitating high-speed data processing and communication.
- Automotive Networks: Used in vehicle communication systems to ensure fast and secure data exchange between different electronic components.
- Consumer Electronics: Enhances connectivity and performance in devices such as smartphones and tablets.
- Medical Equipment: Critical in medical devices for accurate and fast data handling, ensuring patient safety and operational precision.
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