HC5513BIP
- Mfr.Part #
- HC5513BIP
- Manufacturer
- Intersil
- Package / Case
- 22-DIP (0.400, 10.16mm)
- Datasheet
- Download
- Description
- SLIC, 2-4 CONVERSION, PDIP22
- Stock
- 640
- In Stock :
- 640
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Intersil
- Product Category :
- Telecom
- Mounting Type :
- Through Hole
- Power (Watts) :
- 150 mW
- Current - Supply :
- 5.5mA
- Operating Temperature :
- -40°C ~ 85°C
- JESD-609 Code :
- e0
- Neg Supply Voltage-Nom :
- -5 V
- Number of Functions :
- 1
- Terminal Position :
- Dual
- JESD-30 Code :
- R-PDIP-T22
- Number of Circuits :
- 1
- Telecom IC Type :
- SLIC
- Supplier Device Package :
- 22-PDIP
- Number of Terminals :
- 22
- Terminal Form :
- THROUGH-HOLE
- Function :
- Subscriber Line Interface Concept (SLIC)
- Reach Compliance Code :
- Unknown
- Temperature Grade :
- Industrial
- Package Shape :
- RECTANGULAR
- Terminal Finish :
- TIN LEAD
- Product Status :
- Active
- Voltage - Supply :
- ±4.75V ~ 5.25V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Package :
- Bulk
- Package / Case :
- 22-DIP (0.400, 10.16mm)
- Series :
- -
- Manufacturer :
- Rochester Electronics LLC
- Qualification Status :
- COMMERCIAL
- Interface :
- 2-Wire, 4-Wire
- Pbfree Code :
- No
- Surface Mount :
- No
- Datasheets
- HC5513BIP

Telecom Intersil HC5513BIP Overview
The Telecom Intersil HC5513BIP represents a state-of-the-art Subscriber Line Interface Circuit (SLIC), specifically engineered for robust 24-channel conversion applications. This premium IC, packaged in a PDIP22 format, ensures superior reliability and performance for advanced telecom infrastructures. Designed by Intersil, a leader in semiconductor solutions, the HC5513BIP is ideal for high-density applications requiring efficient power distribution and fault management. Its capabilities make it particularly suited for deployment in large-scale business environments, offering unmatched performance that supports massive volume purchases.
HC5513BIP Features
The HC5513BIP chip boasts several key features that enhance its utility in telecom and networking equipment. Key features include its robust voltage handling capability, high integration that supports 24 conversion channels in a single package, and improved power management technology. This reliability and high-channel density make it a crucial component in demanding telecom applications.
HC5513BIP Applications
- Multi-Line Telecommunication Systems: Utilized in office PBX or large telecommunication systems to manage multiple phone lines, ensuring clear and reliable communication.
- VoIP Gateways: Acts as the primary interface circuit in Voice over IP (VoIP) gateways, converting analog phone signals into digital for internet transmission.
- Telecom Switching Equipment: Integrated into switching systems to handle the setup, supervision, breakdown, and information interchange of telephone calls.
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