HC55185DIM

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Mfr.Part #
HC55185DIM
Manufacturer
Intersil
Package / Case
28-LCC (J-Lead)
Datasheet
Download
Description
SLIC, 2-4 CONVERSION, BIPOLAR
Stock
26,394
In Stock :
26,394

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Manufacturer :
Intersil
Product Category :
Telecom
Operating Temperature :
-40°C ~ 85°C
JESD-609 Code :
e0
Package :
Bag
Pin Count :
28
Terminal Finish :
TIN LEAD
Temperature Grade :
Industrial
Qualification Status :
Not Qualified
Technology :
Bipolar
Seated Height-Max :
4.57 mm
Number of Pins :
28
Terminal Position :
QUAD
HTS Code :
8542.39.00.01
Product Status :
Obsolete
Lead Free :
Contains Lead
Number of Terminals :
28
Package Shape :
Square
Mounting Type :
Surface Mount
Manufacturer :
Rochester Electronics LLC
Pbfree Code :
No
RoHS :
Non-Compliant
Terminal Form :
J BEND
Voltage - Supply :
-
Number of Functions :
1
Surface Mount :
yes
Peak Reflow Temperature (Cel) :
240
Number of Circuits :
1
Telecom IC Type :
SLIC
Packaging :
Bulk
Terminal Pitch :
1.27 mm
Reach Compliance Code :
Unknown
JESD-30 Code :
S-PQCC-J28
Length :
11.505 mm
Function :
Subscriber Line Interface Concept (SLIC)
Width :
11.505 mm
Series :
RSLIC18
Interface :
-
Package / Case :
28-LCC (J-Lead)
Current - Supply :
-
Supplier Device Package :
28-PLCC (11.51x11.51)
Datasheets
HC55185DIM
Introducing Telecom Intersil HC55185DIM from Xinshop,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 85°C, Number of Pins:28, Mounting Type:Surface Mount, Package / Case:28-LCC (J-Lead), HC55185DIM pinout, HC55185DIM datasheet PDF, HC55185DIM amp .Beyond Telecom Intersil HC55185DIM ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil HC55185DIM


Telecom Intersil HC55185DIM Overview

The Telecom Intersil HC55185DIM, crafted by renowned manufacturer Intersil, is a state-of-the-art Subscriber Line Interface Circuit (SLIC) designed for superior performance in telecommunications. This device stands out in the market with its ability to handle 24 conversion processes, utilizing a bipolar technology that enhances signal clarity and reliability. The HC55185DIM is engineered to meet the rigorous demands of modern telecom applications, offering robust functionality that supports advanced telecommunication infrastructures. Its capacity for high-quality voice transmission and efficient power management makes it an essential component for developers looking to innovate and enhance their communication solutions.

HC55185DIM Features

This SLIC module boasts several key features including its bipolar signaling capability which ensures low signal distortion and high integrity voice transmission. The device’s 24 conversion ability is pivotal for complex telecommunication systems, providing flexible interfacing options and compatibility with multiple telephony standards. Additionally, the HC55185DIM offers excellent electrical characteristics under a range of operating conditions, making it highly reliable and efficient for sustained use.

HC55185DIM Applications

  • Residential Gateways: The HC55185DIM is ideal for deployment in residential gateways where reliable voice services are critical. It facilitates clear and stable telephony connections, enhancing user experience in home communication setups.
  • Enterprise PBX Systems: In enterprise environments, this SLIC can be integrated into Private Branch Exchange (PBX) systems to provide high-quality voice communications. Its robust design supports the complex needs of corporate telecommunication frameworks.
  • VoIP Equipment: Leveraging its high-performance conversion capabilities, the HC55185DIM excels in Voice over IP (VoIP) applications. It ensures smooth digital-to-analog conversions, crucial for maintaining voice quality over IP networks.
  • Rural Telecommunications: For rural areas where robust communication technology is necessary to overcome infrastructural challenges, the HC55185DIM provides reliable services. Its adaptability and resilience make it suitable for demanding environments and conditions.
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Shipping Cost

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