IR25607STRPBF

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Mfr.Part #
IR25607STRPBF
Manufacturer
Infineon Technologies
Package / Case
16-SOIC (0.295, 7.50mm Width)
Datasheet
Download
Description
IC GATE DRVR HALF-BRIDGE 16SOIC
Stock
3,867
In Stock :
3,867

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Manufacturer :
Infineon Technologies
Product Category :
Gate Drivers
Terminal Position :
Dual
Mount :
Surface Mount
Fall Time (Typ) :
25 ns
Packaging :
Tape and Reel (TR)
Rise Time :
35ns
Package / Case :
16-SOIC (0.295, 7.50mm Width)
ECCN Code :
EAR99
Operating Temperature :
-40°C~150°C TJ
Radiation Hardening :
No
Output Voltage :
20V
Turn On Delay Time :
20 ns
Published :
1996
Supply Voltage :
15V
Mounting Type :
Surface Mount
High Side Voltage - Max (Bootstrap) :
600V
Operating Supply Current :
340µA
Propagation Delay :
150 ns
Gate Type :
IGBT, N-Channel MOSFET
Logic Voltage - VIL, VIH :
6V 9.5V
Power Dissipation :
1.25W
Lead Free :
Lead Free
Number of Pins :
16
Max Output Current :
2.5A
Base Part Number :
IR25607SPBF
Max Power Dissipation :
1.25W
Factory Lead Time :
12 Weeks
Channel Type :
Independent
Rise / Fall Time (Typ) :
25ns 17ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Input Type :
Non-Inverting
Current - Peak Output (Source, Sink) :
2.5A 2.5A
Weight :
665.986997mg
Number of Drivers :
2
Power Supplies :
15V
RoHS Status :
ROHS3 Compliant
Turn-Off Delay Time :
94 ns
Driven Configuration :
Half-Bridge
Output Current :
2A
Terminal Form :
Gull wing
Number of Terminations :
16
Voltage - Supply :
10V~20V
Datasheets
IR25607STRPBF
Introducing Gate Drivers Infineon Technologies IR25607STRPBF from Xinshop,where excellence meets affordability. This product stands out with its Package / Case:16-SOIC (0.295, 7.50mm Width), Operating Temperature:-40°C~150°C TJ, Mounting Type:Surface Mount, Number of Pins:16, Base Part Number:IR25607SPBF, Number of Terminations:16, IR25607STRPBF pinout, IR25607STRPBF datasheet PDF, IR25607STRPBF amp .Beyond Gate Drivers Infineon Technologies IR25607STRPBF ,we also offer FAN3180TSX, DGD2104MS8-13, IRS2005STRPBF, Our vast inventory has you covered. Contact us now for immediate solutions.

Infineon Technologies IR25607STRPBF


Gate Drivers Infineon Technologies IR25607STRPBF Overview

Introducing the IR25607STRPBF from Infineon Technologies, a high-performance half-bridge gate driver designed to address the rigorous demands of modern power conversion applications. This 16SOIC package device optimizes the interface between control ICs and power MOSFETs or IGBTs, ensuring efficient and reliable operation. The IR25607STRPBF excels in delivering robust power management solutions, making it an essential component for developers looking to enhance system efficiency and reliability. Its integration features and robust design are tailored to simplify the implementation process in complex circuits, thus reducing time-to-market and enhancing product performance.

IR25607STRPBF Features

The IR25607STRPBF gate driver is equipped with numerous features that enhance its functionality and reliability in demanding applications. It offers a high driving current capacity, integrated under-voltage lockout, and advanced protection features such as over-current and thermal shutdown. Additionally, the device's dual high-side and low-side output drivers provide flexibility, making it ideal for a variety of switching architectures.

IR25607STRPBF Applications

  • Motor Control Systems: Utilizes its high-current outputs to drive the gates of MOSFETs or IGBTs in electric vehicle motor controllers, improving efficiency and response times in traction and other high-power motor applications.
  • Power Supplies: Enhances the reliability and efficiency of switch-mode power supplies (SMPS) by providing improved gate drive performance, which is crucial for achieving lower switching losses and better thermal management.
  • Renewable Energy Systems: Plays a critical role in solar inverters and wind turbine converters by ensuring robust and efficient gate driving, which is essential for maximizing energy conversion and reducing wastage in renewable energy installations.
  • Consumer Electronics: Supports the development of compact and efficient consumer electronics by driving MOSFETs in power management modules that require high efficiency with minimal heat generation.
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