IXDN409PI
- Mfr.Part #
- IXDN409PI
- Manufacturer
- Littelfuse
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC GATE DRVR LOW-SIDE 8DIP
- Stock
- 44,429
- In Stock :
- 44,429
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- Manufacturer :
- Littelfuse
- Product Category :
- Gate Drivers
- RoHS Status :
- RoHS Compliant
- Current - Peak Output (Source, Sink) :
- 9A 9A
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Input Type :
- Non-Inverting
- Nominal Supply Current :
- 3mA
- Base Part Number :
- IXD*409
- Time@Peak Reflow Temperature-Max (s) :
- 35
- ECCN Code :
- EAR99
- Published :
- 2004
- Supply Voltage :
- 18V
- Propagation Delay :
- 40 ns
- Fall Time (Typ) :
- 15 ns
- Logic Voltage - VIL, VIH :
- 0.8V 3.5V
- Package :
- Tube
- Number of Terminations :
- 8
- Voltage - Supply :
- 4.5V~35V
- Base Product Number :
- IXDN409
- Qualification Status :
- Not Qualified
- Pin Count :
- 8
- Number of Pins :
- 8
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mount :
- Through Hole
- Packaging :
- Tube
- Seated Height-Max :
- 4.57 mm
- Channel Type :
- Single
- Terminal Position :
- Dual
- Width :
- 7.62mm
- JESD-609 Code :
- e3
- Temperature Grade :
- Military
- Turn On Time :
- 0.04 µs
- Operating Temperature :
- -55°C~150°C TJ
- Number of Functions :
- 1
- Surface Mount :
- No
- Terminal Form :
- THROUGH-HOLE
- Weight :
- 599.989307mg
- Supplier Device Package :
- 8-PDIP
- High Side Driver :
- No
- Interface IC Type :
- BUFFER OR INVERTER BASED MOSFET DRIVER
- Reach Compliance Code :
- not_compliant
- HTS Code :
- 8542.39.00.01
- JESD-30 Code :
- R-PDIP-T8
- Length :
- 9.59mm
- Turn Off Time :
- 0.036 μs
- Peak Reflow Temperature (Cel) :
- 260
- Manufacturer :
- IXYS Corporation
- Terminal Pitch :
- 2.54mm
- Number of Terminals :
- 8
- Height Seated (Max) :
- 4.57mm
- Rise Time :
- 15ns
- Turn On Delay Time :
- 40 ps
- Gate Type :
- IGBT, N-Channel, P-Channel MOSFET
- Max Output Current :
- 9A
- Series :
- --
- Number of Drivers :
- 1
- Rise / Fall Time (Typ) :
- 10ns 10ns
- Output Current :
- 9A
- Product Status :
- Obsolete
- Output Peak Current Limit-Nom :
- 9A
- Package Shape :
- RECTANGULAR
- Terminal Finish :
- Matte Tin (Sn)
- Driven Configuration :
- Low-Side
- Lead Free :
- Lead Free
- Mounting Type :
- Through Hole
- Datasheets
- IXDN409PI

Gate Drivers Littelfuse IXDN409PI Overview
Introducing the Gate Drivers Littelfuse IXDN409PI, an essential component for professionals seeking robust and reliable low-side gate driving solutions. Manufactured by Littelfuse, this IC gate driver is designed to efficiently manage power and switching in electronic circuits. Encased in an 8DIP package, it offers a streamlined integration into existing layouts, making it an ideal choice for high-performance applications. Its ability to drive MOSFETs and IGBTs with precision ensures optimal functioning of your electronic assemblies, promoting enhanced system reliability and performance.
IXDN409PI Features
The IXDN409PI gate driver is packed with features designed for high-efficiency and durable operation. Key attributes include its low drive impedance and fast switching capabilities, which help in reducing transition losses. The device also supports a wide range of input logic levels, making it versatile across various digital interfaces. Additionally, its built-in protection against over-current provides further reliability and safety, making it a trustworthy choice for critical applications.
IXDN409PI Applications
- Motor Control Systems: Utilizes its fast switching capabilities to enhance performance and efficiency in electric motor drivers.
- Power Converters: Provides reliable gate driving for MOSFETs and IGBTs used in DC-DC and AC-DC converters, ensuring stable operation.
- Renewable Energy Systems: Employs robust gate driving in solar inverters and wind turbine converters, optimizing energy conversion and grid performance.
- Automotive Applications: Drives components in electric vehicle powertrain systems, supporting advancements in automotive efficiency and emissions reductions.
- LED Lighting Systems: Used in high-power LED lighting setups, improving energy efficiency and reducing thermal footprint.
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