LPC1830FET180,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Operating Temperature :

-40°C~85°C TA

Package / Case :

180-TFBGA

Power Supplies :

2.5/3.3V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Core Processor :

ARM® Cortex®-M3

ROM (words) :

65536

Program Memory Type :

ROMless

Published :

2010

Number of I/O :

118

Has ADC :

yes

Base Part Number :

LPC1830

Pin Count :

180

Terminal Form :

Ball

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

PWM Channels :

yes

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Supply Voltage-Min (Vsup) :

2.2V

Speed :

180MHz

JESD-30 Code :

S-PBGA-B180

External Data Bus Width :

32

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

CPU Family :

CORTEX-M3

Data Converter :

A/D 8x10b; D/A 1x10b

Bit Size :

32

Terminal Position :

BOTTOM

Width :

12mm

Core Size :

32-Bit

DMA Channels :

yes

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

1.2mm

Packaging :

Tray

Supply Voltage :

3.3V

Mounting Type :

Surface Mount

JESD-609 Code :

e1

Number of Terminations :

180

Address Bus Width :

24

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Surface Mount :

yes

Terminal Pitch :

0.8mm

Supply Voltage-Max (Vsup) :

3.6V

Series :

LPC18xx

Length :

12mm

Factory Lead Time :

12 Weeks

ROM Programmability :

Flash

Qualification Status :

Not Qualified

Source Url Status Check Date :

2013-06-14 00:00:00

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

200K x 8

Oscillator Type :

Internal

DAC Channels :

yes

Clock Frequency :

25MHz

Peak Reflow Temperature (Cel) :

NOT SPECIFIED