MCIMX6S6AVM10AD

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Surface Mount :

yes

Number of Terminations :

624

Supply Voltage-Min (Vsup) :

1.4V

JESD-30 Code :

S-PBGA-B624

Factory Lead Time :

14 Weeks

RoHS Status :

ROHS3 Compliant

Graphics Acceleration :

yes

Time@Peak Reflow Temperature-Max (s) :

40

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

External Data Bus Width :

32

Speed :

1GHz

Supply Voltage-Max (Vsup) :

1.5V

HTS Code :

8542.31.00.01

Operating Temperature :

-40°C~125°C TJ

Security Features :

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Ethernet :

10/100/1000Mbps (1)

Terminal Form :

Ball

Additional Interfaces :

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Height Seated (Max) :

1.6mm

Boundary Scan :

yes

Co-Processors/DSP :

Multimedia; NEON™ SIMD

Series :

i.MX6S

Display & Interface Controllers :

Keypad, LCD

Integrated Cache :

yes

Low Power Mode :

yes

Address Bus Width :

16

Length :

21mm

Package / Case :

624-LFBGA

Core Processor :

ARM® Cortex®-A9

Format :

Floating Point

JESD-609 Code :

e1

Voltage - I/O :

1.8V 2.5V 2.8V 3.3V

USB :

USB 2.0 + PHY (4)

Number of Cores/Bus Width :

1 Core 32-Bit

RAM Controllers :

LPDDR2, LVDDR3, DDR3

Terminal Pitch :

0.8mm

Terminal Position :

BOTTOM

Peak Reflow Temperature (Cel) :

260

Packaging :

Tray

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)