MCP2003BT-E/MF
- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock :
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Power Supply Type :
- Single
- Differential Output :
- No
- Interface Standard :
- ISO 17987; ISO 7637
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Series :
- --
- Number of Functions :
- 1
- Number of Receivers :
- 1
- Operating Supply Voltage :
- 5.5, 30 V
- Receive Delay-Max :
- 6000 ns
- Mounting :
- Surface Mount
- Published :
- 2016
- Terminal Form :
- NO LEAD
- Mount :
- Surface Mount
- Driver Number of Bits :
- 1
- Package / Case :
- 8-VDFN Exposed Pad
- Transmit Delay-Max :
- 4000 ns
- Subcategory :
- Interface ICs
- Number of Transmitters :
- 1
- Height Seated (Max) :
- 1mm
- HTS Code :
- 8542.39.00.01
- Interface IC Type :
- LINE TRANSCEIVER
- Voltage - Supply :
- 5.5V~30V
- Length :
- 3mm
- Receiver Number of Bits :
- 1
- Supply Voltage :
- 12V
- Base Product Number :
- MCP2003
- Simplex/Duplex :
- Half Duplex
- Brand :
- Microchip Technology
- JESD-30 Code :
- S-PDSO-N8
- Operating Supply Current :
- 160 uA
- Width :
- 3mm
- Base Part Number :
- MCP2003
- Product Category :
- LIN Transceivers
- Temperature Grade :
- Automotive
- Terminal Pitch :
- 0.65mm
- Input Characteristics :
- Schmitt Trigger
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Number of Drivers/Receivers :
- 1/1
- Type :
- Transceiver
- Supplier Package :
- DFN
- Pin Count :
- 8
- Duplex :
- Half
- Data Rate :
- 20kBaud
- Package Shape :
- Square
- Protocol :
- LINbus
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supplier Device Package :
- 8-DFN (3x3)
- Factory Lead Time :
- 8 Weeks
- Terminal Position :
- Dual
- Product Type :
- LIN Transceivers
- Protocols Supported :
- SO 17987/SAE J2602
- Reach Compliance Code :
- Compliant
- Packaging :
- Tape and Reel (TR)
- ECCN Code :
- EAR99
- Seated Height-Max :
- 1 mm
- Operating Temperature :
- -40°C~125°C
- Product Status :
- Active
- Screening Level :
- TS 16949
- Number of Terminations :
- 8
- JESD-609 Code :
- e3
- Manufacturer :
- Microchip
- Package :
- Tape and Reel (TR)
- Number of Terminals :
- 8
- Mounting Type :
- Surface Mount
- Maximum Data Rate :
- 20 KBd
- RoHS :
- Details
- Datasheets
- MCP2003BT-E/MF

Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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