MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Product Type :
- LIN Transceivers
- Supplier Device Package :
- 8-DFN (3x3)
- Product Status :
- Active
- Packaging :
- Tape and Reel (TR)
- Pin Count :
- 8
- Supply Voltage :
- 12V
- JESD-609 Code :
- e3
- Protocols Supported :
- SO 17987/SAE J2602
- JESD-30 Code :
- S-PDSO-N8
- HTS Code :
- 8542.39.00.01
- Terminal Form :
- NO LEAD
- Published :
- 2016
- Temperature Grade :
- Automotive
- Mount :
- Surface Mount
- Number of Terminals :
- 8
- Transmit Delay-Max :
- 4000 ns
- Mounting Type :
- Surface Mount
- Brand :
- Microchip Technology
- Operating Supply Voltage :
- 5.5, 30 V
- Length :
- 3mm
- Terminal Position :
- Dual
- Interface IC Type :
- LINE TRANSCEIVER
- Driver Number of Bits :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Manufacturer :
- Microchip
- Base Product Number :
- MCP2003
- Data Rate :
- 20kBaud
- Width :
- 3mm
- Interface Standard :
- ISO 17987; ISO 7637
- Type :
- Transceiver
- Receiver Number of Bits :
- 1
- Operating Temperature :
- -40°C~125°C
- Reach Compliance Code :
- Compliant
- Package :
- Tape and Reel (TR)
- Factory Lead Time :
- 8 Weeks
- Maximum Data Rate :
- 20 KBd
- Duplex :
- Half
- Number of Terminations :
- 8
- ECCN Code :
- EAR99
- Number of Receivers :
- 1
- Input Characteristics :
- Schmitt Trigger
- Seated Height-Max :
- 1 mm
- Number of Functions :
- 1
- Power Supply Type :
- Single
- Surface Mount :
- yes
- Series :
- --
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Number of Drivers/Receivers :
- 1/1
- Subcategory :
- Interface ICs
- Voltage - Supply :
- 5.5V~30V
- Number of Transmitters :
- 1
- Differential Output :
- No
- Receive Delay-Max :
- 6000 ns
- Height Seated (Max) :
- 1mm
- Product Category :
- LIN Transceivers
- Simplex/Duplex :
- Half Duplex
- Package Shape :
- Square
- Supplier Package :
- DFN
- RoHS Status :
- ROHS3 Compliant
- Operating Supply Current :
- 160 uA
- Base Part Number :
- MCP2003
- Terminal Pitch :
- 0.65mm
- RoHS :
- Details
- Protocol :
- LINbus
- Screening Level :
- TS 16949
- Package / Case :
- 8-VDFN Exposed Pad
- Mounting :
- Surface Mount
- Datasheets
- MCP2003BT-E/MF
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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