MCP2003BT-E/MF
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- Mfr.Part #
- MCP2003BT-E/MF
- Manufacturer
- Microchip Technology
- Package / Case
- 8-VDFN Exposed Pad
- Datasheet
- Download
- Description
- IC TRANSCEIVER HALF 1/1 8DFN
- Stock
- 2,597
- In Stock ：
- 2,597
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- Manufacturer :
- Microchip Technology
- Product Category :
- Drivers, Receivers, Transceivers
- Mount :
- Surface Mount
- Supplier Device Package :
- 8-DFN (3x3)
- Factory Lead Time :
- 8 Weeks
- Base Part Number :
- MCP2003
- Terminal Form :
- NO LEAD
- Screening Level :
- TS 16949
- Voltage - Supply :
- 5.5V~30V
- Operating Supply Voltage :
- 5.5, 30 V
- Surface Mount :
- yes
- RoHS Status :
- ROHS3 Compliant
- Power Supply Type :
- Single
- Height Seated (Max) :
- 1mm
- Terminal Position :
- Dual
- Simplex/Duplex :
- Half Duplex
- Differential Output :
- No
- Product Category :
- LIN Transceivers
- JESD-30 Code :
- S-PDSO-N8
- Subcategory :
- Interface ICs
- Package / Case :
- 8-VDFN Exposed Pad
- Supply Voltage :
- 12V
- Receive Delay-Max :
- 6000 ns
- Product Type :
- LIN Transceivers
- Package Shape :
- Square
- Supplier Package :
- DFN
- Seated Height-Max :
- 1 mm
- Data Rate :
- 20kBaud
- Brand :
- Microchip Technology
- Number of Receivers :
- 1
- Packaging :
- Tape and Reel (TR)
- HTS Code :
- 8542.39.00.01
- Duplex :
- Half
- Driver Number of Bits :
- 1
- Number of Terminals :
- 8
- Number of Drivers/Receivers :
- 1/1
- Number of Transmitters :
- 1
- Operating Supply Current :
- 160 uA
- RoHS :
- Details
- Product Status :
- Active
- JESD-609 Code :
- e3
- Receiver Number of Bits :
- 1
- ECCN Code :
- EAR99
- Protocols Supported :
- SO 17987/SAE J2602
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Pin Count :
- 8
- Base Product Number :
- MCP2003
- Terminal Pitch :
- 0.65mm
- Length :
- 3mm
- Series :
- --
- Manufacturer :
- Microchip
- Interface Standard :
- ISO 17987; ISO 7637
- Width :
- 3mm
- Temperature Grade :
- Automotive
- Type :
- Transceiver
- Maximum Data Rate :
- 20 KBd
- Mounting :
- Surface Mount
- Terminal Finish :
- Matte Tin (Sn) - annealed
- Published :
- 2016
- Reach Compliance Code :
- Compliant
- Protocol :
- LINbus
- Input Characteristics :
- Schmitt Trigger
- Package :
- Tape and Reel (TR)
- Operating Temperature :
- -40°C~125°C
- Mounting Type :
- Surface Mount
- Transmit Delay-Max :
- 4000 ns
- Interface IC Type :
- LINE TRANSCEIVER
- Number of Functions :
- 1
- Number of Terminations :
- 8
- Datasheets
- MCP2003BT-E/MF
Drivers, Receivers, Transceivers Microchip Technology MCP2003BT-E/MF Overview
The MCP2003BT-E/MF from Microchip Technology is a robust and versatile half-duplex transceiver designed for LIN bus applications within the automotive sector. This compact component in an 8-pin DFN package is engineered to facilitate reliable communication in networks requiring high electromagnetic compatibility (EMC) and electrostatic discharge (ESD) protection. The integration of this IC in your systems ensures reduced external component count while boosting overall reliability and performance. It's ideal for designers looking to enhance automotive communication systems with a component that offers both high durability and exceptional functionality.
MCP2003BT-E/MF Features
This transceiver boasts several key features that make it suitable for demanding applications. It includes a robust ESD protection system, capable of withstanding up to ±15kV on the bus pins, ensuring reliability in harsh environments. The device operates over a broad temperature range of -40°C to +125°C, making it suitable for automotive applications. Additionally, it supports a maximum baud rate of 20kbps, which is typical for LIN bus communication protocols. The MCP2003BT-E/MF also includes a power-saving sleep mode, further enhancing its efficiency in vehicle networks.
MCP2003BT-E/MF Applications
- Automotive Networks: Used in LIN bus systems for communication between components like sensors, actuators, and control modules.
- Industrial Automation: Facilitates robust data communication in industrial equipment requiring high levels of noise immunity and reliability.
- Building Automation Systems: Integrates into building management systems for enhanced communication reliability in devices such as HVAC controls and lighting systems.
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