MCP6474T-E/STVAO
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- Mfr.Part #
- MCP6474T-E/STVAO
- Manufacturer
- Microchip Technology
- Package / Case
- 14-TSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- IC CMOS 4 CIRCUIT 14TSSOP
- Stock
- 18,369
- In Stock ：
- 18,369
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- Manufacturer :
- Microchip Technology
- Product Category :
- Instrumentation, OP Amps, Buffer Amps
- Package / Case :
- 14-TSSOP (0.173, 4.40mm Width)
- Reach Compliance Code :
- Compliant
- Voltage - Input Offset :
- 1.5mV
- Output Type :
- Rail-to-Rail
- Supply Voltage Limit-Max :
- 6.5V
- Terminal Position :
- Dual
- Package Shape :
- RECTANGULAR
- Terminal Form :
- Gull wing
- Width :
- 4.4 mm
- Current - Output / Channel :
- 32 mA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Common Mode Rejection Ratio :
- 88 dB
- Product Status :
- Active
- Current - Supply :
- 100μA
- Gain Bandwidth Product :
- 2MHz
- Number of Functions :
- 4
- Voltage - Supply, Single/Dual (±) :
- 2V~5.5V
- Temperature Grade :
- Automotive
- Package :
- Tape and Reel (TR)
- Average Bias Current-Max (IIB) :
- 0.00035μA
- Length :
- 5mm
- Number of Circuits :
- 4
- Current - Input Bias :
- 1pA
- RoHS Status :
- ROHS3 Compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Base Product Number :
- MCP6474
- Number of Terminations :
- 14
- Seated Height-Max :
- 1.2 mm
- Surface Mount :
- yes
- JESD-30 Code :
- R-PDSO-G14
- Mounting Type :
- Surface Mount
- Number of Terminals :
- 14
- Unity Gain BW-Nom :
- 2000 kHz
- Screening Level :
- AEC-Q100
- Supply Voltage :
- 3V
- Operating Temperature :
- -40°C~125°C TA
- Manufacturer :
- Microchip Technology Inc
- Input Offset Voltage-Max :
- 1500 µV
- Packaging :
- Tape and Reel (TR)
- Slew Rate :
- 1.1V/μs
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supplier Device Package :
- 14-TSSOP
- Series :
- Automotive, AEC-Q100
- Height Seated (Max) :
- 1.2mm
- Terminal Pitch :
- 0.65mm
- Amplifier Type :
- GENERAL PURPOSE
- Datasheets
- MCP6474T-E/STVAO
Instrumentation, OP Amps, Buffer Amps Microchip Technology MCP6474T-E/STVAO Overview
Introducing the MCP6474T-E/STVAO, an innovative Integrated Circuit (IC) meticulously crafted by Microchip Technology, designed specifically for applications in instrumentation, operational amplifiers (OP Amps), and buffer amplifiers. This 14-TSSOP packaged CMOS IC comprises four circuits, each engineered to deliver unparalleled performance and reliability in diverse electronic systems.
MCP6474T-E/STVAO Features
- High precision: With advanced CMOS technology, this IC ensures precise signal processing, making it ideal for instrumentation applications where accuracy is paramount.
- Multi-functionality: Equipped with four circuits, it offers versatility in various OP Amp and buffer amplifier configurations, catering to different system requirements.
- Low power consumption: Designed with energy efficiency in mind, it minimizes power consumption without compromising performance, extending battery life in portable devices.
- Compact form factor: Housed in a space-saving 14-TSSOP package, it facilitates integration into compact electronic designs, optimizing board space utilization.
- Robust design: Engineered by Microchip Technology, a trusted leader in semiconductor solutions, it boasts a robust design, ensuring long-term reliability and durability in demanding environments.
MCP6474T-E/STVAO Applications
- Medical instrumentation: This IC is utilized in medical devices such as patient monitoring systems and diagnostic equipment, where precision and reliability are critical for accurate measurement and analysis of physiological parameters.
- Industrial automation: In industrial control systems and automation equipment, the MCP6474T-E/STVAO serves as a key component for signal conditioning, enabling seamless integration and efficient operation in manufacturing processes.
- Audio amplification: It finds application in audio amplifiers and sound reinforcement systems, delivering clear and distortion-free audio signals for immersive listening experiences in professional audio equipment and consumer electronics.
- Sensor interfaces: Integrated into sensor interface circuits, it facilitates signal amplification and conditioning in sensor networks, ensuring accurate and reliable detection of environmental parameters in IoT devices and smart sensors.
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