MK52DN512CMD10

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

PWM Channels :

yes

Packaging :

Tray

Published :

2011

RoHS Status :

ROHS3 Compliant

Base Part Number :

MK52DN512

Supply Voltage-Min (Vsup) :

1.71V

Length :

13mm

Surface Mount :

yes

Supply Voltage :

3.3V

Terminal Pitch :

1mm

Factory Lead Time :

13 Weeks

Package / Case :

144-LBGA

Bit Size :

32

Data Converter :

A/D 41x16b; D/A 2x12b

DMA Channels :

yes

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

JESD-609 Code :

e1

Operating Temperature :

-40°C~85°C TA

Qualification Status :

Not Qualified

CPU Family :

CORTEX-M4

Has ADC :

yes

JESD-30 Code :

S-PBGA-B144

Width :

13mm

Terminal Position :

BOTTOM

Clock Frequency :

50MHz

HTS Code :

8542.31.00.01

Power Supplies :

1.8/3.3V

Time@Peak Reflow Temperature-Max (s) :

40

Core Size :

32-Bit

Supply Voltage-Max (Vsup) :

3.6V

Terminal Form :

Ball

Series :

Kinetis K50

Connectivity :

EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG

ROM (words) :

524288

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

DAC Channels :

yes

Peripherals :

DMA, I2S, LVD, POR, PWM, WDT

Core Processor :

ARM® Cortex®-M4

Number of Terminations :

144

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of I/O :

96

Terminal Finish :

TIN SILVER COPPER

RAM Size :

128K x 8

Mounting Type :

Surface Mount

Program Memory Type :

Flash

Speed :

100MHz

Oscillator Type :

Internal

Program Memory Size :

512KB 512K x 8

ECCN Code :

3A991.A.2

Peak Reflow Temperature (Cel) :

260