MPC8250AVVMHBC

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Height Seated (Max) :

1.65mm

Time@Peak Reflow Temperature-Max (s) :

40

RoHS Status :

ROHS3 Compliant

Boundary Scan :

yes

Number of Terminations :

480

Factory Lead Time :

12 Weeks

External Data Bus Width :

64

Voltage - I/O :

3.3V

Integrated Cache :

yes

RAM Controllers :

DRAM, SDRAM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Series :

MPC82xx

Number of Cores/Bus Width :

1 Core 32-Bit

Co-Processors/DSP :

Communications; RISC CPM

Surface Mount :

yes

Length :

37.5mm

Low Power Mode :

No

Graphics Acceleration :

No

Ethernet :

10/100Mbps (3)

Address Bus Width :

32

Core Processor :

PowerPC G2

Bit Size :

32

Speed :

266MHz

Operating Temperature :

0°C~105°C TA

Format :

Floating Point

Peak Reflow Temperature (Cel) :

260

JESD-30 Code :

S-PBGA-B480

ECCN Code :

3A991.A.2

Terminal Pitch :

1.27mm

JESD-609 Code :

e1

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Terminal Form :

Ball

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Base Part Number :

MPC8250

Package / Case :

480-LBGA Exposed Pad

Published :

1997