MPC8360VVAGDG

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Length :

37.5mm

Clock Frequency :

66.67MHz

Integrated Cache :

yes

Boundary Scan :

yes

Terminal Pitch :

1mm

Time@Peak Reflow Temperature-Max (s) :

40

Address Bus Width :

32

Supply Voltage-Min (Vsup) :

1.14V

Co-Processors/DSP :

Communications; QUICC Engine

Bit Size :

32

Packaging :

Tray

Peak Reflow Temperature (Cel) :

260

HTS Code :

8542.31.00.01

Series :

MPC83xx

Published :

2002

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Surface Mount :

yes

Operating Temperature :

0°C~105°C TA

Factory Lead Time :

12 Weeks

Speed :

400MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Format :

Floating Point

Ethernet :

10/100/1000Mbps (1)

Terminal Finish :

TIN COPPER/TIN SILVER

Package / Case :

740-LBGA

External Data Bus Width :

32

Base Part Number :

MPC8360

Voltage - I/O :

1.8V 2.5V 3.3V

Additional Interfaces :

DUART, HDLC, I2C, PCI, SPI, UART

Supply Voltage :

1.2V

USB :

USB 1.x (1)

Graphics Acceleration :

No

RAM Controllers :

DDR, DDR2

Power Supplies :

1.8/2.53.3V

Number of Terminations :

740

RoHS Status :

ROHS3 Compliant

Supply Voltage-Max (Vsup) :

1.26V

JESD-30 Code :

S-PBGA-B740

Low Power Mode :

yes

Height Seated (Max) :

1.69mm

Terminal Position :

BOTTOM

Core Processor :

PowerPC e300

ECCN Code :

3A991.A.2

JESD-609 Code :

e2

Number of Cores/Bus Width :

1 Core 32-Bit