MPC850DEZQ50BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

JESD-30 Code :

S-PBGA-B256

Factory Lead Time :

12 Weeks

Number of Cores/Bus Width :

1 Core 32-Bit

Power Supplies :

3.3V

Supply Voltage-Max (Vsup) :

3.6V

Ethernet :

10Mbps (1)

Packaging :

Tray

Terminal Finish :

Tin/Lead (Sn/Pb)

Bit Size :

32

Terminal Form :

Ball

RAM Controllers :

DRAM

Format :

FIXED POINT

JESD-609 Code :

e0

Address Bus Width :

26

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Supply Voltage-Min (Vsup) :

3V

Package / Case :

256-BBGA

Terminal Pitch :

1.27mm

Integrated Cache :

yes

Base Part Number :

MPC850

Time@Peak Reflow Temperature-Max (s) :

40

Low Power Mode :

yes

RoHS Status :

Non-RoHS Compliant

ECCN Code :

3A991.A.2

Height Seated (Max) :

2.54mm

Voltage - I/O :

3.3V

Length :

23mm

Supply Voltage :

3.3V

Graphics Acceleration :

No

HTS Code :

8542.31.00.01

Peak Reflow Temperature (Cel) :

260

Series :

MPC8xx

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Position :

BOTTOM

External Data Bus Width :

32

Boundary Scan :

yes

Number of Terminations :

256

Published :

1997

Co-Processors/DSP :

Communications; CPM

Operating Temperature :

0°C~95°C TA

Speed :

50MHz

USB :

USB 1.x (1)

Surface Mount :

yes

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC