MPC850SRZQ80BU

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Time@Peak Reflow Temperature-Max (s) :

40

Package / Case :

256-BBGA

Terminal Pitch :

1.27mm

HTS Code :

8542.31.00.01

Ethernet :

10Mbps (1)

Terminal Position :

BOTTOM

Number of Terminations :

256

Terminal Finish :

Tin/Lead (Sn/Pb)

Height Seated (Max) :

2.54mm

Surface Mount :

yes

Format :

FIXED POINT

Series :

MPC8xx

Published :

1998

Voltage - I/O :

3.3V

USB :

USB 1.x (1)

Integrated Cache :

yes

Bit Size :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Power Supplies :

3.3V

Low Power Mode :

yes

RoHS Status :

Non-RoHS Compliant

JESD-609 Code :

e0

Graphics Acceleration :

No

Supply Voltage :

3.3V

RAM Controllers :

DRAM

Factory Lead Time :

26 Weeks

Terminal Form :

Ball

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-30 Code :

S-PBGA-B256

Peak Reflow Temperature (Cel) :

260

Packaging :

Tray

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Supply Voltage-Min (Vsup) :

3V

Boundary Scan :

yes

Supply Voltage-Max (Vsup) :

3.6V

ECCN Code :

5A991

Additional Interfaces :

HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

Speed :

80MHz

Base Part Number :

MPC850

Length :

23mm

External Data Bus Width :

32

Co-Processors/DSP :

Communications; CPM

Address Bus Width :

26

Operating Temperature :

0°C~95°C TA