MPC8555ECPXALF

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Format :

Floating Point

Packaging :

Tray

Peak Reflow Temperature (Cel) :

245

Supply Voltage-Max (Vsup) :

1.26V

Supply Voltage-Min (Vsup) :

1.14V

JESD-609 Code :

e0

Supply Voltage :

1.2V

Package / Case :

783-BBGA, FCBGA

Bit Size :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Number of Terminations :

783

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Length :

29mm

Clock Frequency :

166MHz

Published :

2002

Operating Temperature :

-40°C~105°C TA

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

Speed :

667MHz

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Low Power Mode :

yes

Series :

MPC85xx

Terminal Pitch :

1mm

USB :

USB 2.0 (1)

Height Seated (Max) :

3.75mm

Terminal Finish :

Tin/Lead (Sn/Pb)

Voltage - I/O :

2.5V 3.3V

JESD-30 Code :

S-PBGA-B783

Integrated Cache :

yes

Core Processor :

PowerPC e500

Base Part Number :

MPC8555

Surface Mount :

yes

Co-Processors/DSP :

Communications; CPM, Security; SEC

Boundary Scan :

yes

RoHS Status :

Non-RoHS Compliant

Security Features :

Cryptography, Random Number Generator

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Form :

Ball

Address Bus Width :

64

HTS Code :

8542.31.00.01

ECCN Code :

5A002.A.1

Ethernet :

10/100/1000Mbps (2)

External Data Bus Width :

64

Terminal Position :

BOTTOM

RAM Controllers :

DDR, SDRAM