MPC855TVR50D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Series :

MPC8xx

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

8 Weeks

Surface Mount :

yes

Peak Reflow Temperature (Cel) :

245

Clock Frequency :

50MHz

Format :

FIXED POINT

Terminal Pitch :

1.27mm

External Data Bus Width :

32

RAM Controllers :

DRAM

Voltage - I/O :

3.3V

JESD-30 Code :

S-PBGA-B357

Bit Size :

32

Ethernet :

10Mbps (1), 10/100Mbps (1)

Published :

1997

Co-Processors/DSP :

Communications; CPM

JESD-609 Code :

e1

Number of Cores/Bus Width :

1 Core 32-Bit

Number of Terminations :

357

ECCN Code :

3A991.A.2

Address Bus Width :

32

Integrated Cache :

yes

Low Power Mode :

yes

Packaging :

Tray

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Graphics Acceleration :

No

Boundary Scan :

yes

Supply Voltage :

3.3V

Terminal Finish :

TIN SILVER COPPER

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Position :

BOTTOM

RoHS Status :

ROHS3 Compliant

Power Supplies :

3.3V

Supply Voltage-Max (Vsup) :

3.465V

Supply Voltage-Min (Vsup) :

3.135V

Height Seated (Max) :

2.52mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Package / Case :

357-BBGA

HTS Code :

8542.31.00.01

Speed :

50MHz

Base Part Number :

MPC855

Length :

25mm

Operating Temperature :

0°C~95°C TA

Terminal Form :

Ball