MPC855TZQ66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Peak Reflow Temperature (Cel) :

245

Package / Case :

357-BBGA

Series :

MPC8xx

Length :

25mm

Address Bus Width :

32

Terminal Position :

BOTTOM

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Ethernet :

10Mbps (1), 10/100Mbps (1)

Surface Mount :

yes

Integrated Cache :

yes

Speed :

66MHz

Number of Terminations :

357

Terminal Form :

Ball

JESD-609 Code :

e0

Boundary Scan :

yes

HTS Code :

8542.31.00.01

Time@Peak Reflow Temperature-Max (s) :

30

Factory Lead Time :

12 Weeks

Voltage - I/O :

3.3V

Base Part Number :

MPC855

Co-Processors/DSP :

Communications; CPM

Supply Voltage-Min (Vsup) :

3.135V

Terminal Pitch :

1.27mm

RoHS Status :

Non-RoHS Compliant

Height Seated (Max) :

2.52mm

Number of Cores/Bus Width :

1 Core 32-Bit

Operating Temperature :

0°C~95°C TA

Supply Voltage-Max (Vsup) :

3.465V

JESD-30 Code :

S-PBGA-B357

Power Supplies :

3.3V

Clock Frequency :

50MHz

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

External Data Bus Width :

32

Packaging :

Tray

RAM Controllers :

DRAM

Graphics Acceleration :

No

Format :

FIXED POINT

Low Power Mode :

yes

ECCN Code :

3A991.A.2

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Terminal Finish :

Tin/Lead (Sn/Pb)

Bit Size :

32

Supply Voltage :

3.3V

Published :

1997