MPC859DSLCZP66A

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Height Seated (Max) :

2.52mm

Package / Case :

357-BBGA

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

JESD-609 Code :

e0

RoHS Status :

Non-RoHS Compliant

Factory Lead Time :

12 Weeks

Number of Cores/Bus Width :

1 Core 32-Bit

Integrated Cache :

yes

RAM Controllers :

DRAM

Address Bus Width :

32

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Pitch :

1.27mm

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

External Data Bus Width :

32

Length :

25mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Graphics Acceleration :

No

Surface Mount :

yes

Format :

FIXED POINT

Base Part Number :

MPC859

Supply Voltage :

1.8V

Number of Terminations :

357

Low Power Mode :

yes

Power Supplies :

1.83.3V

Published :

1999

Terminal Position :

BOTTOM

Bit Size :

32

Packaging :

Tray

Voltage - I/O :

3.3V

Terminal Form :

Ball

Ethernet :

10Mbps (1), 10/100Mbps (1)

Series :

MPC8xx

Peak Reflow Temperature (Cel) :

220

Operating Temperature :

-40°C~100°C TA

Supply Voltage-Max (Vsup) :

1.9V

Supply Voltage-Min (Vsup) :

1.7V

HTS Code :

8542.31.00.01

Boundary Scan :

yes

Time@Peak Reflow Temperature-Max (s) :

30

JESD-30 Code :

S-PBGA-B357

Co-Processors/DSP :

Communications; CPM

ECCN Code :

3A991.A.2

Speed :

66MHz