MPC860DEVR66D4

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Packaging :

Tray

Supply Voltage-Min (Vsup) :

3.135V

Supply Voltage :

3.3V

Supply Voltage-Max (Vsup) :

3.465V

Number of Terminations :

357

Ethernet :

10Mbps (2)

Terminal Pitch :

1.27mm

Terminal Form :

Ball

Series :

MPC8xx

Format :

FIXED POINT

Surface Mount :

yes

Speed :

66MHz

Address Bus Width :

32

Operating Temperature :

0°C~95°C TA

RAM Controllers :

DRAM

Graphics Acceleration :

No

Co-Processors/DSP :

Communications; CPM

Height Seated (Max) :

2.52mm

Voltage - I/O :

3.3V

Additional Interfaces :

I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

Base Part Number :

MPC860

Package / Case :

357-BBGA

HTS Code :

8542.31.00.01

External Data Bus Width :

32

Number of Cores/Bus Width :

1 Core 32-Bit

Peak Reflow Temperature (Cel) :

245

Power Supplies :

3.3V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Factory Lead Time :

26 Weeks

Low Power Mode :

yes

Time@Peak Reflow Temperature-Max (s) :

30

Bit Size :

32

Clock Frequency :

50MHz

Published :

2004

Boundary Scan :

yes

RoHS Status :

ROHS3 Compliant

ECCN Code :

3A991.A.2

JESD-30 Code :

S-PBGA-B357

Length :

25mm

Terminal Finish :

TIN SILVER COPPER

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

Terminal Position :

BOTTOM

JESD-609 Code :

e1

Integrated Cache :

yes