MPC885ZP133

Manufacturer :

NXP Semiconductors

Product Category :

Microprocessors

Terminal Form :

Ball

Published :

1999

Format :

FIXED POINT

Low Power Mode :

yes

Power Supplies :

1.83.3V

Package / Case :

357-BBGA

Surface Mount :

yes

Supply Voltage :

1.8V

Co-Processors/DSP :

Communications; CPM, Security; SEC

External Data Bus Width :

32

Bit Size :

32

Integrated Cache :

yes

HTS Code :

8542.31.00.01

Address Bus Width :

32

Additional Interfaces :

CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART

Operating Temperature :

0°C~95°C TA

RAM Controllers :

DRAM

Terminal Position :

BOTTOM

Voltage - I/O :

3.3V

Peak Reflow Temperature (Cel) :

245

USB :

USB 2.0 (1)

Base Part Number :

MPC885

Supply Voltage-Max (Vsup) :

1.9V

Graphics Acceleration :

No

Time@Peak Reflow Temperature-Max (s) :

30

Boundary Scan :

yes

JESD-609 Code :

e0

Terminal Finish :

Tin/Lead (Sn/Pb)

Terminal Pitch :

1.27mm

ECCN Code :

5A002.A.1

Height Seated (Max) :

2.52mm

Supply Voltage-Min (Vsup) :

1.7V

Number of Terminations :

357

Factory Lead Time :

12 Weeks

Number of Cores/Bus Width :

1 Core 32-Bit

Length :

25mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Speed :

133MHz

JESD-30 Code :

S-PBGA-B357

Packaging :

Tray

Security Features :

Cryptography

Ethernet :

10Mbps (3), 10/100Mbps (2)

uPs/uCs/Peripheral ICs Type :

MICROPROCESSOR, RISC

RoHS Status :

Non-RoHS Compliant

Series :

MPC8xx