PEB 3324 E V1.4

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Mfr.Part #
PEB 3324 E V1.4
Manufacturer
Infineon Technologies
Package / Case
176-LBGA
Datasheet
Download
Description
IC TELECOM INTERFACE 176-LBGA
Stock
47,784
In Stock :
47,784

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Manufacturer :
Infineon Technologies
Product Category :
Telecom
Packaging :
Tray
Interface :
ADPCM
Number of Circuits :
4
Power (Watts) :
400mW
Package / Case :
176-LBGA
Base Part Number :
PEB3324
Operating Temperature :
-40°C~85°C
Supplier Device Package :
PG-LBGA-176
Series :
VINETIC®
RoHS Status :
Non-RoHS Compliant
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Function :
Analog Voice Access
Mounting Type :
Surface Mount
Datasheets
PEB 3324 E V1.4
Introducing Telecom Infineon Technologies PEB 3324 E V1.4 from Xinshop,where excellence meets affordability. This product stands out with its Package / Case:176-LBGA, Base Part Number:PEB3324, Operating Temperature:-40°C~85°C, Mounting Type:Surface Mount, PEB 3324 E V1.4 pinout, PEB 3324 E V1.4 datasheet PDF, PEB 3324 E V1.4 amp .Beyond Telecom Infineon Technologies PEB 3324 E V1.4 ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



PEB3324 Telecom device 4 Circuits

PEB 3324 E V1.4 Overview


Space is saved on the board by using the 176-LBGA package.Telecommunications equipment is packed according to Tray's method.In this case, Surface Mount is the mounting type.A 4 circuit is the heart of this telecom IC .Operating temperatures of -40°C~85°C can ensure reliable performance.PEB3324 is the base part number, which can be used to find more related parts.The VINETIC® series is capable of providing a number of similar functions to the W series.

PEB 3324 E V1.4 Features


Available in the 176-LBGA package


PEB 3324 E V1.4 Applications


There are a lot of Infineon Technologies
PEB 3324 E V1.4 Telecom applications.


  • Channel Service Units (CSUs): T1/E1/J1
  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
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