S29GL256P11FFI012

Manufacturer :

Infineon Technologies

Product Category :

Memory

Access Time (Max) :

110 ns

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-609 Code :

e1

RoHS Status :

ROHS3 Compliant

Time@Peak Reflow Temperature-Max (s) :

40

Power Supplies :

3/3.3V

Page Size :

8/16words

HTS Code :

8542.32.00.51

Density :

256 Mb

Memory Format :

Flash

Memory Size :

256Mb 32M x 8

Memory Type :

Non-Volatile

Number of Sectors/Size :

256

Voltage - Supply :

2.7V~3.6V

Mounting Type :

Surface Mount

Number of Terminations :

64

Toggle Bit :

yes

Supply Voltage :

3V

Write Cycle Time - Word, Page :

110ns

Terminal Position :

BOTTOM

Operating Temperature :

-40°C~85°C TA

Terminal Finish :

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Height Seated (Max) :

1.4mm

Radiation Hardening :

No

Terminal Pitch :

1mm

Sector Size :

128K

Supply Voltage-Max (Vsup) :

3.6V

Sync/Async :

ASYNCHRONOUS

Common Flash Interface :

yes

Supply Voltage-Min (Vsup) :

2.7V

Number of Pins :

64

Alternate Memory Width :

8

Length :

13mm

Mount :

Surface Mount

Programming Voltage :

3V

Peak Reflow Temperature (Cel) :

260

Nominal Supply Current :

110mA

Data Polling :

yes

ECCN Code :

3A991.B.1.A

Memory Interface :

Parallel

Number of Functions :

1

Command User Interface :

yes

Width :

11mm

Packaging :

Tape and Reel (TR)

Published :

2003

Package / Case :

64-LBGA

Standby Current-Max :

0.000005A

Ready/Busy :

yes

Factory Lead Time :

16 Weeks

Organization :

256MX1

Memory Width :

1

Series :

GL-P