W25Q80DVSNIG

Manufacturer :

Winbond Electronics Corporation

Product Category :

Memory

Terminal Finish :

Tin (Sn)

Data Retention Time-Min :

20

Terminal Position :

Dual

Operating Temperature :

-40°C~85°C TA

Qualification Status :

Not Qualified

Memory Size :

8Mb 1M x 8

RoHS Status :

ROHS3 Compliant

Memory Type :

Non-Volatile

Memory Width :

1

Memory Density :

8388608 bit

Serial Bus Type :

SPI

Memory Format :

Flash

Number of Functions :

1

Packaging :

Tube

Height :

1.75mm

Standby Current-Max :

0.000005A

JESD-609 Code :

e3

Memory Interface :

SPI

Supply Voltage :

3V

Write Cycle Time - Word, Page :

3ms

Supply Voltage-Min (Vsup) :

2.7V

Clock Frequency :

104MHz

Parallel/Serial :

Serial

Ambient Temperature Range High :

85°C

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Surface Mount :

yes

Mounting Type :

Surface Mount

Length :

4.9mm

Organization :

8MX1

Width :

3.9mm

Terminal Pitch :

1.27mm

Series :

SpiFlash®

JESD-30 Code :

R-PDSO-G8

Number of Terminations :

8

Published :

2010

Write Protection :

HARDWARE/SOFTWARE

Supply Voltage-Max (Vsup) :

3.6V

Operating Mode :

SYNCHRONOUS

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Programming Voltage :

3V

Endurance :

100000 Write/Erase Cycles

Voltage - Supply :

2.7V~3.6V

Package / Case :

8-SOIC (0.154, 3.90mm Width)

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Power Supplies :

3/3.3V

Supply Current-Max :

0.025mA

Factory Lead Time :

10 Weeks