X66AK2H06AAAW2

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Mfr.Part #
X66AK2H06AAAW2
Manufacturer
Texas Instruments
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC DSP ARM SOC BGA
Stock
14,371
In Stock :
14,371

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Interface :
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
Voltage - Core :
Variable
Address Bus Width :
24
RAM Size :
6MB
Low Power Mode :
yes
Pbfree Code :
No
HTS Code :
8542.31.00.01
Type :
DSP+ARM®
Length :
40mm
Height Seated (Max) :
3.75mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1mm
Terminal Form :
Ball
Lead Free :
Contains Lead
Frequency :
1.2GHz
Operating Temperature :
0°C~85°C TC
Voltage - I/O :
0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
Format :
Floating Point
Data Bus Width :
32b
Speed :
1200 MHz
Base Part Number :
66AK2H06
Core Architecture :
ARM
Max Supply Voltage :
997mV
On Chip Data RAM :
8.375MB
Series :
66AK2Hx KeyStone Multicore
Operating Supply Voltage :
950mV
Package / Case :
1517-BBGA, FCBGA
Terminal Position :
BOTTOM
ECCN Code :
3A001.A.3
Integrated Cache :
yes
Number of Pins :
1517
Number of Timers/Counters :
14
Non-Volatile Memory :
ROM (384kB)
Supply Voltage :
1V
Min Supply Voltage :
902mV
Boundary Scan :
yes
Packaging :
Tray
Mount :
Surface Mount
Mounting Type :
Surface Mount
Datasheets
X66AK2H06AAAW2
Introducing DSP (Digital Signal Processors) Texas Instruments X66AK2H06AAAW2 from Xinshop,where excellence meets affordability. This product stands out with its Type:DSP+ARM®, Operating Temperature:0°C~85°C TC, Base Part Number:66AK2H06, Package / Case:1517-BBGA, FCBGA, Number of Pins:1517, Mounting Type:Surface Mount, X66AK2H06AAAW2 pinout, X66AK2H06AAAW2 datasheet PDF, X66AK2H06AAAW2 amp .Beyond DSP (Digital Signal Processors) Texas Instruments X66AK2H06AAAW2 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments X66AK2H06AAAW2


DSP Texas Instruments X66AK2H06AAAW2 Overview

The DSP Texas Instruments X66AK2H06AAAW2 is a highly integrated digital signal processor (DSP) and system-on-chip (SoC) designed for advanced digital processing tasks. Engineered by Texas Instruments, a leader in semiconductor technology, this IC is optimized for high-performance applications requiring efficient data manipulation and real-time processing. Its robust architecture enables enhanced processing capabilities, making it an ideal choice for demanding environments where precision and speed are critical. This product stands out for its ability to integrate multiple functions into a single device, streamlining design and reducing overall system costs.

X66AK2H06AAAW2 Features

This DSP SoC features a powerful ARM processor core, integrated memory interfaces, and extensive peripheral connectivity. Its high-speed data processing capabilities are complemented by low-power consumption, making it suitable for both portable and stationary applications. The device's BGA package ensures reliable electrical connections and a compact footprint, facilitating easier integration into a variety of hardware setups.

X66AK2H06AAAW2 Applications

  • Telecommunications: Utilized in communication infrastructure to manage signal processing tasks efficiently, ensuring clearer signal transmission and reception.
  • Audio Processing: Ideal for high-fidelity audio applications, including digital mixers and sound enhancement devices, where it can provide real-time audio signal processing.
  • Automotive Systems: Applies to advanced driver-assistance systems (ADAS) for processing and analyzing real-time sensor data, enhancing vehicle safety and performance.
  • Industrial Automation: Used in automated control systems for processing and controlling machinery operations, improving precision and reliability in manufacturing processes.
This HTML structure provides a detailed yet concise overview and feature list for the X66AK2H06AAAW2, along with specific applications highlighting its versatility and adaptability in various technological fields.
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