XC1701LPDG8C
- Mfr.Part #
- XC1701LPDG8C
- Manufacturer
- AMD Xilinx
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC PROM SER CONFIG 1M 3.3V 8-DIP
- Stock
- 29,044
- In Stock :
- 29,044
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- Manufacturer :
- AMD Xilinx
- Product Category :
- Configuration Proms for FPGAs
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Memory IC Type :
- CONFIGURATION MEMORY
- Width :
- 7.62mm
- Terminal Position :
- Dual
- Length :
- 9.3599mm
- Operating Temperature :
- 0°C~70°C
- Memory Width :
- 1
- Memory Size :
- 1Mb
- Pbfree Code :
- yes
- Programmable Type :
- OTP
- Output Characteristics :
- 3-STATE
- Qualification Status :
- Not Qualified
- Surface Mount :
- No
- Base Part Number :
- XC1701L
- Mounting Type :
- Through Hole
- Number of Functions :
- 1
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- JESD-609 Code :
- e3
- Peak Reflow Temperature (Cel) :
- 250
- Parallel/Serial :
- Serial
- Number of Terminations :
- 8
- Power Supplies :
- 3.3V
- Clock Frequency :
- 15MHz
- I/O Type :
- COMMON
- Published :
- 2004
- Packaging :
- Tube
- Pin Count :
- 8
- Additional Feature :
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Supply Voltage-Min (Vsup) :
- 3V
- Supply Voltage-Max (Vsup) :
- 3.6V
- Terminal Pitch :
- 2.54mm
- Terminal Finish :
- Matte Tin (Sn)
- Standby Current-Max :
- 0.00005A
- Voltage - Supply :
- 3V~3.6V
- RoHS Status :
- RoHS Compliant
- Organization :
- 1MX1
- Height Seated (Max) :
- 4.5974mm
- Supply Voltage :
- 3.3V
- Operating Mode :
- SYNCHRONOUS
- Supply Current-Max :
- 0.01mA
- Number of Pins :
- 8
- Datasheets
- XC1701LPDG8C

[Configuration Proms for FPGAs AMD Xilinx XC1701LPDG8C] Overview
Introducing the XC1701LPDG8C by AMD Xilinx, a high-performance IC PROM designed for serial configuration of Field-Programmable Gate Arrays (FPGAs). This innovative solution redefines configurability, offering seamless integration and reliable performance in diverse electronic applications.
With a capacity of 1M, operating at 3.3V, and housed in an 8DIP package, this IC PROM caters to the demanding requirements of modern electronic systems. Whether deployed in industrial automation, telecommunications, or automotive electronics, the XC1701LPDG8C delivers unmatched configurability and operational stability.
Unlock the full potential of your FPGA-based designs with the XC1701LPDG8C, setting new standards in configuration reliability and efficiency.
XC1701LPDG8C Features
- High-performance IC PROM for FPGA configuration
- 1M capacity with 3.3V operation
- 8DIP package for easy integration
- Serial configuration for enhanced flexibility
- Robust design for reliable performance
- Compatible with various FPGA platforms
- Ideal for industrial, telecommunications, and automotive applications
XC1701LPDG8C Applications
- Industrial Automation: Implement precise control and monitoring functions in manufacturing processes. The XC1701LPDG8C enables rapid FPGA configuration, ensuring seamless operation of automated systems in industrial environments.
- Telecommunications: Enhance network infrastructure with efficient FPGA configuration solutions. The XC1701LPDG8C facilitates swift reconfiguration of telecom equipment, enabling dynamic adaptation to changing network demands.
- Automotive Electronics: Power next-generation automotive electronics with reliable FPGA configuration. The XC1701LPDG8C supports quick reprogramming of FPGA-based systems, enabling advanced functionalities such as driver assistance and infotainment.
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