XC3S1400A-4FGG676C
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- Mfr.Part #
- XC3S1400A-4FGG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BGA
- Datasheet
- Download
- Description
- IC FPGA 502 I/O 676FBGA
- Stock
- 2,301
- In Stock ：
- 2,301
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Position :
- BOTTOM
- Base Part Number :
- XC3S1400A
- Supply Voltage :
- 1.2V
- Number of Pins :
- 676
- Number of Gates :
- 1400000
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Supplies :
- 1.22.5/3.3V
- Termination :
- SMD/SMT
- Number of LABs/CLBs :
- 2816
- Width :
- 27mm
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- Pin Count :
- 676
- Series :
- Spartan®-3A
- Mount :
- Surface Mount
- Terminal Form :
- Ball
- Peak Reflow Temperature (Cel) :
- 250
- Factory Lead Time :
- 10 Weeks
- Number of Logic Elements/Cells :
- 25344
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Package / Case :
- 676-BGA
- Number of Outputs :
- 408
- JESD-609 Code :
- e1
- ECCN Code :
- 3A991.D
- Published :
- 2007
- Number of I/O :
- 502
- RAM Size :
- 72kB
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Pbfree Code :
- yes
- Number of Terminations :
- 676
- Total RAM Bits :
- 589824
- Speed Grade :
- 4
- Length :
- 27mm
- Operating Temperature :
- 0°C~85°C TJ
- Operating Supply Voltage :
- 1.2V
- Frequency :
- 250MHz
- Mounting Type :
- Surface Mount
- Combinatorial Delay of a CLB-Max :
- 0.71 ns
- REACH SVHC :
- Unknown
- Datasheets
- XC3S1400A-4FGG676C
FPGAs AMD Xilinx XC3S1400A-4FGG676C Overview
The FPGAs AMD Xilinx XC3S1400A-4FGG676C is a highly capable field-programmable gate array designed for advanced digital processing applications. This IC FPGA, part of AMD Xilinx's renowned Spartan-3A series, comes packaged in a 676-pin FBGA, providing a robust platform for versatile and scalable hardware programming. With its 502 I/O pins, it offers exceptional integration flexibility, making it ideal for a broad range of applications where performance and space are critical. Its advanced features support complex digital computations while maintaining low power consumption and high reliability, crucial for today’s high-demand systems.
XC3S1400A-4FGG676C Features
- 676-pin FBGA package for compact and efficient layout.
- 502 user I/Os for extensive peripheral and function integration.
- High-density logic integration suitable for complex circuit designs.
- Optimized for low-power operation, enhancing system reliability and longevity.
- Supports a wide range of digital processing functions, adaptable to both simple and complex systems.
XC3S1400A-4FGG676C Applications
- Telecommunications Infrastructure
This FPGA can be integrated into various telecommunications systems, enhancing data transmission capabilities and supporting high-speed communication protocols.
- Automotive Driver Assistance Systems
In automotive applications, the XC3S1400A-4FGG676C supports the development of advanced driver-assistance systems (ADAS), improving vehicle safety and performance.
- Consumer Electronics
Used in consumer electronics, this FPGA enables sophisticated features in devices such as smart TVs and gaming consoles, providing support for high-resolution graphics and multi-functional user interfaces.
- Industrial Automation
In industrial settings, the FPGA can be utilized to automate complex processes, enhance machine control, and increase manufacturing precision and efficiency.
- Medical Devices
The XC3S1400A-4FGG676C is ideal for medical applications, where it can be used to process complex data algorithms in diagnostic and imaging equipment, ensuring fast and reliable patient care.
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