XC7K325T-1FBG676C
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- Mfr.Part #
- XC7K325T-1FBG676C
- Manufacturer
- AMD Xilinx
- Package / Case
- 676-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 400 I/O 676FCBGA
- Stock
- 970
- In Stock ：
- 970
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- Manufacturer :
- AMD Xilinx
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Number of Registers :
- 407600
- Speed Grade :
- -1
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Total RAM Bits :
- 16404480
- Combinatorial Delay of a CLB-Max :
- 0.74 ns
- Terminal Position :
- BOTTOM
- Published :
- 2009
- Power Supplies :
- 11.83.3V
- HTS Code :
- 8542.39.00.01
- Number of Pins :
- 676
- Pbfree Code :
- yes
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1V
- Length :
- 27mm
- Number of Terminations :
- 676
- Number of I/O :
- 400
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Width :
- 27mm
- Surface Mount :
- yes
- Voltage - Supply :
- 0.97V~1.03V
- Height Seated (Max) :
- 2.54mm
- Clock Frequency :
- 1098MHz
- ECCN Code :
- 3A991.D
- Factory Lead Time :
- 11 Weeks
- Packaging :
- Tray
- Terminal Form :
- Ball
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 25475
- Number of Logic Elements/Cells :
- 326080
- Contact Plating :
- Copper, Silver, Tin
- Terminal Pitch :
- 1mm
- Number of Outputs :
- 400
- Pin Count :
- 676
- RAM Size :
- 2MB
- Qualification Status :
- Not Qualified
- Mounting Type :
- Surface Mount
- Base Part Number :
- XC7K325T
- Package / Case :
- 676-BBGA, FCBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Memory Type :
- DDR3
- Memory Size :
- 1GB
- Series :
- Kintex®-7
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- XC7K325T-1FBG676C
FPGAs AMD Xilinx XC7K325T-1FBG676C Overview
Introducing the FPGAs AMD Xilinx XC7K325T-1FBG676C, a highly versatile and powerful Field Programmable Gate Array designed for demanding applications that require robust processing capabilities and high-speed interfacing. This IC FPGA from AMD Xilinx is packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA), providing ample I/O options with up to 400 pins available for multi-faceted connectivity. Ideal for developers focusing on advanced systems requiring integration of multiple functions within a compact and efficient footprint, this product stands out in both performance and flexibility, making it an excellent choice for bulk purchases by B2B clients seeking reliable and scalable solutions.
XC7K325T-1FBG676C Features
The XC7K325T-1FBG676C FPGA is equipped with features that cater to high-performance and multifunctional requirements. With its 400 I/O options, it can handle extensive data and signal processing tasks simultaneously. The 676FCBGA package ensures robust physical connectivity and heat dissipation, crucial for maintaining reliability and performance in rigorous operational conditions.
XC7K325T-1FBG676C Applications
- Telecommunications Infrastructure: The FPGA can be utilized to manage signal processing and data flow in high-speed communication networks, enhancing the efficiency and reliability of telecommunication systems.
- Automotive Driver Assistance Systems (ADAS): By integrating this FPGA into ADAS, manufacturers can process complex algorithms needed for real-time decision making, improving vehicle safety and performance.
- Medical Imaging Equipment: This product's high data throughput and processing capabilities make it suitable for advanced medical imaging technologies, enabling faster and more accurate diagnostics.
- Industrial Automation: In automation systems, the XC7K325T-1FBG676C can control and process multiple inputs and outputs simultaneously, increasing the system's responsiveness and efficiency.
- Aerospace and Defense: Its robust design and extensive I/O make it ideal for applications in aerospace and defense, where reliability under extreme conditions is critical.
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