XC7Z007S-1CLG400I
- Mfr.Part #
- XC7Z007S-1CLG400I
- Manufacturer
- AMD Xilinx
- Package / Case
- 400-LFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A9 667MHZ 400BGA
- Stock
- 37,296
- In Stock :
- 37,296
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Series :
- Zynq®-7000
- Terminal Pitch :
- 0.8mm
- RoHS Status :
- ROHS3 Compliant
- Speed :
- 667MHz
- Height Seated (Max) :
- 1.6mm
- RAM Size :
- 256KB
- Terminal Position :
- BOTTOM
- RAM (words) :
- 256000
- Architecture :
- MCU, FPGA
- Supply Voltage :
- 1V
- Terminal Form :
- Ball
- Clock Frequency :
- 667MHz
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- JESD-30 Code :
- S-PBGA-B400
- Primary Attributes :
- Artix™-7 FPGA, 23K Logic Cells
- Factory Lead Time :
- 10 Weeks
- Package / Case :
- 400-LFBGA, CSPBGA
- Peripherals :
- DMA
- Width :
- 17mm
- Bus Compatibility :
- CAN; ETHERNET; I2C; SPI; UART; USB
- Supply Voltage-Min (Vsup) :
- 0.95V
- Terminal Finish :
- Matte Tin (Sn)
- Supply Voltage-Max (Vsup) :
- 1.05V
- Length :
- 17mm
- HTS Code :
- 8542.31.00.01
- Number of I/O :
- 100
- Pbfree Code :
- yes
- Surface Mount :
- yes
- JESD-609 Code :
- e3
- Published :
- 2016
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Operating Temperature :
- -40°C~100°C TJ
- Number of Terminations :
- 400
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Core Processor :
- Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Boundary Scan :
- yes
- Packaging :
- Tray
- Datasheets
- XC7Z007S-1CLG400I

400 Terminations -40°C~100°C TJ System On Chip Zynq®-7000 Series 100 I/O 1V
This SoC is built on Single ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Single ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 400-LFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Artix™-7 FPGA, 23K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 100 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 400 terminations.There is 667MHz clock frequency that is used in this SoC.
Single ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
Clock Frequency: 667MHz
There are a lot of Xilinx Inc.
XC7Z007S-1CLG400I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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