XCZU2CG-2SFVC784I
- Mfr.Part #
- XCZU2CG-2SFVC784I
- Manufacturer
- AMD Xilinx
- Package / Case
- 784-BFBGA, FCBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-A53 784FCBGA
- Stock
- 44,828
- In Stock :
- 44,828
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- Manufacturer :
- AMD Xilinx
- Product Category :
- System On Chip (SoC)
- Primary Attributes :
- Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
- Connectivity :
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Factory Lead Time :
- 11 Weeks
- Core Processor :
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Surface Mount :
- yes
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- RoHS Status :
- ROHS3 Compliant
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of I/O :
- 252
- JESD-30 Code :
- S-PBGA-B784
- RAM Size :
- 256KB
- Packaging :
- Tray
- Architecture :
- MCU, FPGA
- Peripherals :
- DMA, WDT
- Number of Terminations :
- 784
- Package / Case :
- 784-BFBGA, FCBGA
- Supply Voltage :
- 0.85V
- HTS Code :
- 8542.31.00.01
- Series :
- Zynq® UltraScale+™ MPSoC CG
- uPs/uCs/Peripheral ICs Type :
- MICROPROCESSOR CIRCUIT
- Speed :
- 533MHz, 1.3GHz
- Moisture Sensitivity Level (MSL) :
- 4 (72 Hours)
- Operating Temperature :
- -40°C~100°C TJ
- Published :
- 2016
- Datasheets
- XCZU2CG-2SFVC784I

784 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 252 I/O 0.85V
This SoC is built on Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, this SoC has been developed.There is a 784-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+™ MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.Ideally, a power supply with a voltage of 0.85V should be used.system on a chip benefits from 784 terminations.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2CG-2SFVC784I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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