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  6. XCZU4EG-1FBVB900E
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    Mfr.Part #
    XCZU4EG-1FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    677
    In Stock ：
    677

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Published :
    2016
    Architecture :
    MCU, FPGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Packaging :
    Tray
    RAM Size :
    256KB
    Number of I/O :
    204
    Factory Lead Time :
    11 Weeks
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Speed :
    500MHz, 600MHz, 1.2GHz
    HTS Code :
    8542.31.00.01
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Peripherals :
    DMA, WDT
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    RoHS Status :
    ROHS3 Compliant
    Operating Temperature :
    0°C~100°C TJ
    Series :
    Zynq® UltraScale+™ MPSoC EG
    Package / Case :
    900-BBGA, FCBGA
    Datasheets
    XCZU4EG-1FBVB900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU4EG-1FBVB900E from Xinshop,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU4EG-1FBVB900E pinout, XCZU4EG-1FBVB900E datasheet PDF, XCZU4EG-1FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EG-1FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4EG-1FBVB900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


    A core processor(s) Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq® UltraScale+™ MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are available in this SoC part.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU4EG-1FBVB900E System On Chip (SoC) applications.


    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
    • Robotics
    • Central alarm system
    • Smart appliances
    • Industrial automation devices
    • Sports
    • Fitness
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