XCZU4EG-2FBVB900I

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Mfr.Part #
XCZU4EG-2FBVB900I
Manufacturer
AMD Xilinx
Package / Case
900-BBGA, FCBGA
Datasheet
Download
Description
IC SOC CORTEX-A53 900FCBGA
Stock
22,065
In Stock :
22,065

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Manufacturer :
AMD Xilinx
Product Category :
System On Chip (SoC)
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Published :
2016
Package / Case :
900-BBGA, FCBGA
Factory Lead Time :
11 Weeks
Architecture :
MCU, FPGA
Series :
Zynq® UltraScale+™ MPSoC EG
Primary Attributes :
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Moisture Sensitivity Level (MSL) :
4 (72 Hours)
Peripherals :
DMA, WDT
RoHS Status :
ROHS3 Compliant
Speed :
533MHz, 600MHz, 1.3GHz
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of I/O :
204
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
HTS Code :
8542.31.00.01
Core Processor :
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size :
256KB
Datasheets
XCZU4EG-2FBVB900I
Introducing System On Chip (SoC) AMD Xilinx XCZU4EG-2FBVB900I from Xinshop,where excellence meets affordability. This product stands out with its Package / Case:900-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, XCZU4EG-2FBVB900I pinout, XCZU4EG-2FBVB900I datasheet PDF, XCZU4EG-2FBVB900I amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EG-2FBVB900I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

AMD Xilinx XCZU4EG-2FBVB900I


-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 204 I/O

This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq® UltraScale+™ MPSoC EG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 204 I/Os in total.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.


There are a lot of Xilinx Inc.


XCZU4EG-2FBVB900I System On Chip (SoC) applications.


  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
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