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  6. XCZU4EV-3FBVB900E
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    Mfr.Part #
    XCZU4EV-3FBVB900E
    Manufacturer
    AMD Xilinx
    Package / Case
    900-BBGA, FCBGA
    Datasheet
    Download
    Description
    IC SOC CORTEX-A53 900FCBGA
    Stock
    39,444
    In Stock ：
    39,444

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    Manufacturer :
    AMD Xilinx
    Product Category :
    System On Chip (SoC)
    Moisture Sensitivity Level (MSL) :
    4 (72 Hours)
    Operating Temperature :
    0°C~100°C TJ
    Published :
    2016
    Architecture :
    MCU, FPGA
    Time@Peak Reflow Temperature-Max (s) :
    NOT SPECIFIED
    Core Processor :
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    Primary Attributes :
    Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
    Series :
    Zynq® UltraScale+™ MPSoC EV
    Factory Lead Time :
    11 Weeks
    Number of I/O :
    204
    RAM Size :
    256KB
    Packaging :
    Tray
    Peak Reflow Temperature (Cel) :
    NOT SPECIFIED
    Peripherals :
    DMA, WDT
    HTS Code :
    8542.31.00.01
    RoHS Status :
    ROHS3 Compliant
    Speed :
    600MHz, 1.5GHz
    Connectivity :
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Package / Case :
    900-BBGA, FCBGA
    Datasheets
    XCZU4EV-3FBVB900E
    Introducing System On Chip (SoC) AMD Xilinx XCZU4EV-3FBVB900E from Xinshop,where excellence meets affordability. This product stands out with its Operating Temperature：0°C~100°C TJ, Package / Case：900-BBGA, FCBGA, XCZU4EV-3FBVB900E pinout, XCZU4EV-3FBVB900E datasheet PDF, XCZU4EV-3FBVB900E amp .Beyond System On Chip (SoC) AMD Xilinx XCZU4EV-3FBVB900E ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

    AMD Xilinx XCZU4EV-3FBVB900E


    0°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC EV Series 204 I/O

    This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s).


    A Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq® UltraScale+™ MPSoC EV series.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq®UltraScale+™ FPGA, 192K+ Logic Cells.Housed in the state-of-art Tray package.204 I/Os in total are included in this SoC part.

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ processor.


    256KB RAM.
    Built on MCU, FPGA.


    There are a lot of Xilinx Inc.


    XCZU4EV-3FBVB900E System On Chip (SoC) applications.


    • Automotive gateway
    • Body control module
    • Industrial transport
    • Industrial robot
    • High-end PLC
    • Vending machines
    • POS Terminals
    • Measurement tools
    • Measurement testers
    • Networked sensors
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